KIT | KIT-Bibliothek | Impressum | Datenschutz
Open Access Logo
§
Volltext
URN: urn:nbn:de:swb:90-411726

A new test configuration to determine the slip modulus of connections between crosswise bonded boards

Flaig, Marcus; Meyer, Nico

Abstract:
A new test method is presented that allows for a more accurate determination of the slip modulus of crossing areas between orthogonally bonded boards compared to the methods used so far. The slip moduli obtained by the new method are compared to the values evaluated from bending tests with CLT beams and from tests with crossing areas subjected to unidirectional shear stresses and the agreement is found to be good.


Zugehörige Institution(en) am KIT Versuchsanstalt für Stahl, Holz und Steine (VAKA)
Publikationstyp Proceedingsbeitrag
Jahr 2014
Sprache Englisch
Identifikator ISBN: 978-1-85790-183-2
KITopen ID: 1000041172
Erschienen in Experimental Research with Timber, 21-23 May 2014, Prague. [Konferenz]. Ed.: K.-U. Schober
Verlag University of Bath, Bath
Seiten 77-84
KIT – Die Forschungsuniversität in der Helmholtz-Gemeinschaft KITopen Landing Page