A new test configuration to determine the slip modulus of connections between crosswise bonded boards
Abstract:
A new test method is presented that allows for a more accurate determination of the slip modulus of crossing areas between orthogonally bonded boards compared to the methods used so far. The slip moduli obtained by the new method are compared to the values evaluated from bending tests with CLT beams and from tests with crossing areas subjected to unidirectional shear stresses and the agreement is found to be good.
| Zugehörige Institution(en) am KIT | Versuchsanstalt für Stahl, Holz und Steine (VAKA) |
| Publikationstyp | Proceedingsbeitrag |
| Publikationsjahr | 2014 |
| Sprache | Englisch |
| Identifikator | ISBN: 978-1-85790-183-2 urn:nbn:de:swb:90-411726 KITopen-ID: 1000041172 |
| Erschienen in | Experimental Research with Timber, 21-23 May 2014, Prague. [Konferenz]. Ed.: K.-U. Schober |
| Verlag | University of Bath |
| Seiten | 77-84 |