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DOI: 10.5445/IR/1000046549
DOI: 10.1039/C4FD00077C
Zitationen: 4
Web of Science
Zitationen: 3

Organic semiconductor distributed feedback laser pixels for lab-on-a-chip applications fabricated by laser-assisted replication

Liu, Xin; Prinz, Stephan; Besser, Heino; Pfleging, Wilhelm; Wissmann, Markus; Vannahme, Christoph; Guttmann, Markus; Mappes, Timo; Koeber, Sebastian; Koos, Christian; Lemmer, Uli

The integration of organic semiconductor distributed feedback (DFB) laser sources into all-polymer chips is promising for biomedical or chemical analysis. However{,} the fabrication of DFB corrugations is often expensive and time-consuming. Here{,} we apply the method of laser-assisted replication using a near-infrared diode laser beam to efficiently fabricate inexpensive poly(methyl methacrylate) (PMMA) chips with spatially localized organic DFB laser pixels. This time-saving fabrication process enables a pre-defined positioning of nanoscale corrugations on the chip and a simultaneous generation of nanoscale gratings for organic edge-emitting laser pixels next to microscale waveguide structures. A single chip of size 30 mm [times] 30 mm can be processed within 5 min. Laser-assisted replication allows for the subsequent addition of further nanostructures without a negative impact on the existing photonic components. The minimum replication area can be defined as being as small as the diode laser beam focus spot size. To complete the fabrication process{,} we encapsulate the chip in PMMA using laser transmission welding.

Zugehörige Institution(en) am KIT Institut für Angewandte Materialien - Angewandte Werkstoffphysik (IAM-AWP)
Institut für Mikrostrukturtechnik (IMT)
Karlsruhe Nano Micro Facility (KNMF)
Institut für Photonik und Quantenelektronik (IPQ)
Lichttechnisches Institut (LTI)
Publikationstyp Zeitschriftenaufsatz
Jahr 2014
Sprache Englisch
Identifikator ISSN: 0301-7249, 1359-6640, 1364-5498
URN: urn:nbn:de:swb:90-465490
KITopen ID: 1000046549
HGF-Programm 43.14.03; LK 01
Erschienen in Faraday discussions
Band 174
Heft Sept
Seiten 153-164
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