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Connecting silicon photonic circuits to multicore fibers by photonic wire bonding

Lindenmann, Nicole; Dottermusch, Stephan; Goedecke, Maria Laura; Hoose, Tobias; Billah, Muhammad Rodlin; Onanuga, Temitope Paul; Hofmann, Andreas; Freude, Wolfgang; Koos, Christian

Photonic wire bonding is demonstrated to enable highly efficient coupling between multi-core fibers and planar silicon photonic circuits. The technique relies on in-situ fabrication of three-dimensional interconnect waveguides between the fiber facet and tapered silicon-on-insulator waveguides. Photonic wire bonding can easily compensate inaccuracies of core placement in the fiber cross-section, does not require active alignment, and is well suited for automated fabrication. We report on the design, on fabrication, and on characterization of photonic wire bonds. In a proof-of-principle experiment, a four-core fiber is coupled to a silicon photonic chip, leading to measured coupling losses as small as 1.7 dB.

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Volltext §
DOI: 10.5445/IR/1000049613
DOI: 10.1109/JLT.2014.2373051
Zitationen: 78
Zitationen: 69
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Angewandte Informatik (IAI)
Institut für Mikrostrukturtechnik (IMT)
Institut für Photonik und Quantenelektronik (IPQ)
Karlsruhe Nano Micro Facility (KNMF)
Karlsruhe School of Optics & Photonics (KSOP)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2015
Sprache Englisch
Identifikator ISSN: 0733-8724, 1558-2213
KITopen-ID: 1000049613
HGF-Programm 43.23.03 (POF III, LK 01) Teratronics
Erschienen in Journal of lightwave technology
Verlag The Optical Society of America (OSA)
Band 33
Heft 4
Seiten 755-760
Projektinformation HYPHEN (EU, H2020, 680916)
Schlagwörter Integrated optics, nanotechnology, optical fibers, optical interconnections, waveguides, photonic wire bonding, two-photon lithography, silicon photonics, multi-core fibers
Nachgewiesen in Dimensions
Web of Science
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