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URN: urn:nbn:de:swb:90-496781
Originalveröffentlichung
DOI: 10.1039/c4lc01440e
Scopus
Zitationen: 8
Web of Science
Zitationen: 8

Polysiloxane layers created by sol-gel and photochemistry: Ideal surfaces for rapid, low-cost and high-strength bonding of epoxy components to polydimethylsiloxane

Wilhelm, E.; Deshpande, K.; Kotz, F.; Schild, D.; Keller, N.; Heissler, S.; Sachsenheimer, K.; Länge, K.; Neumann, C.; Rapp, B.E.

Abstract:
In this article we introduce and compare three techniques for low-cost and rapid bonding of stereolithographically structured epoxy components to polydimethylsiloxane (PDMS). In short, we first create a polysiloxane layer on the epoxy surface via silane surface coupling and polymerization. Afterwards, the modified epoxy surface can be bonded to a PDMS component at room temperature using a handheld corona discharger, which is a commonly used low-cost technique for bonding two PDMS components. Using these methods bonds of desirable strength can be generated within half an hour. Depending on the epoxy resin, we found it necessary to modify the silanization procedure. Therefore, we provide a total of three different silanization techniques that allow bonding of a wide variety of stereolithographically structurable epoxy resins. The first technique is a UV-light induced silanization process which couples a silane that contains an epoxy-ring ((3-glycidoxypropyl)trimethoxysilane (GPTMS)). For surfaces that cannot be modified with this silane we use dimethoxydimethylsilane (DMDMS). This silane can either be coupled to the surface by a sol-g ... mehr


Zugehörige Institution(en) am KIT Institut für Funktionelle Grenzflächen (IFG)
Institut für Mikrostrukturtechnik (IMT)
Institut für Nukleare Entsorgung (INE)
Publikationstyp Zeitschriftenaufsatz
Jahr 2015
Sprache Englisch
Identifikator ISSN: 1473-0197

KITopen-ID: 1000049678
HGF-Programm 47.02.07 (POF III, LK 01)
Erschienen in Lab on a Chip
Band 15
Heft 7
Seiten 1772-1782
Bemerkung zur Veröffentlichung RSC geförderter Open Access-Artikel
Nachgewiesen in Scopus
Web of Science
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