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Factors of subjective heat stress of urban citizens in contexts of everyday life

Kunz-Plapp, T.; Hackenbruch, J.; Schipper, J. W.


Heat waves and the consequent heat stress of urban populations have a growing relevance in urban risk management and strategies of urban adaptation to climate change. In this context, social science studies on subjective heat stress of urban citizens are a new emerging field. To contribute to the understanding of subjective heat stress and its major determinants in a daily life perspective, we conducted a questionnaire survey with 323 respondents in Karlsruhe, Germany, after a heat wave in July and August 2013. Statistical data analysis showed that heat stress is an issue permeating everyday activities. It was found that the subjective heat stress at home is lower than at work and in general. Subjective heat stress in general, at home, and at work was determined by the health impairments experienced during the heat and the feeling of being helplessly exposed to the heat. For heat stress at home, additionally characteristics of the residential building and the built environment played a role. Although the rate of implemented coping measures was rather high, coping measures showed no uniform effect for the subjective heat stress. The results furthermore show that coping with heat is performed within the scopes of action in daily life. ... mehr

Volltext §
DOI: 10.5445/IR/1000049934
DOI: 10.5194/nhessd-3-4619-2015
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Meteorologie und Klimaforschung – Forschungsbereich Troposphäre (IMK-TRO)
Geophysikalisches Institut (GPI)
KIT-Zentrum Klima und Umwelt (ZKU)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2015
Sprache Englisch
Identifikator ISSN: 2195-9269
KITopen-ID: 1000049934
HGF-Programm 12.01.02 (POF III, LK 01) Proc.res.f.multisc.predictab.of weather
Erschienen in Natural hazards and earth system sciences discussions
Verlag European Geosciences Union (EGU)
Band 3
Heft 8
Seiten 4619-4661
Bemerkung zur Veröffentlichung Gefördert durch den KIT-Publikationsfonds
Nachgewiesen in Dimensions
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