Integration of a 140 GHz Packaged LTCC Grid Array Antenna With an InP Detector
| Zugehörige Institution(en) am KIT | Institut für Hochfrequenztechnik und Elektronik (IHE) |
| Publikationstyp | Zeitschriftenaufsatz |
| Publikationsjahr | 2015 |
| Sprache | Englisch |
| Identifikator | ISSN: 2156-3950 KITopen-ID: 1000054310 |
| Erschienen in | IEEE transactions on components, packaging and manufacturing technology |
| Verlag | Institute of Electrical and Electronics Engineers (IEEE) |
| Band | 5 |
| Heft | 8 |
| Seiten | 1060-1068 |
| Schlagwörter | antenna arrays;ceramic packaging;D-band front-end integration and packaging;LTCC grid array antenna;antenna-in-package concept;coplanar ground-signal-ground bond wires;frequency 140 GHz;indium phosphide process;packaged low-temperature cofired ceramic antenna;parallel plate mode;power detector;Antennas;Detectors;III-V semiconductor materials;Indium phosphide;MMICs;Substrates;Wires;Antenna-in-package (AiP);grid array antenna (GAA);low-temperature cofired ceramic (LTCC);parallel plate mode (PPM);parallel plate mode (PPM) |
| Nachgewiesen in | Dimensions Scopus Web of Science |