High-speed metal-filling of through-silicon vias (TSVs) by parallelized magnetic assembly of micro-wires
| Zugehörige Institution(en) am KIT | Institut für Nanotechnologie (INT) |
| Publikationstyp | Proceedingsbeitrag |
| Publikationsjahr | 2016 |
| Sprache | Englisch |
| Identifikator | ISBN: 978-1-5090-1973-1 KITopen-ID: 1000056914 |
| HGF-Programm | 43.22.01 (POF III, LK 01) Functionality by Design |
| Erschienen in | MEMS 2016 : The 29th IEEE International Conference on Micro Electro Mechanical Systems, Shanghai, China, January 24-28, 2016. Ed.: H. Toshiyoshi |
| Verlag | Institute of Electrical and Electronics Engineers (IEEE) |
| Seiten | 577-580 |
| Nachgewiesen in | Scopus Dimensions |