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Ultrarobust Thin-Film Devices from Self-Assembled Metal-Terpyridine Oligomers

Karipidou, Z.; Branchi, B.; Sarpasan, M.; Knorr, N.; Rodin, V.; Friederich, P.; Neumann, T.; Meded, V.; Rosselli, S.; Nelles, G.; Wenzel, W.; Rampi, M.A.; Wrochem, F.von



Abstract (englisch): Ultrathin molecular layers of FeII-terpyridine oligomers allow the fabrication of large-area crossbar junctions by conventional electrode vapor deposition. The junctions are electrically stable for over 2.5 years and operate over a wide range of temperatures (150–360 K) and voltages (±3 V) due to the high cohesive energy and packing density of the oligomer layer. Electrical measurements reveal ideal Richardson–Shottky emission in surprising agreement with electrochemical, optical, and photoemission data.


Zugehörige Institution(en) am KIT Institut für Nanotechnologie (INT)
Publikationstyp Zeitschriftenaufsatz
Jahr 2016
Sprache Englisch
Identifikator DOI: 10.1002/adma.201504847
ISSN: 0935-9648
URN: urn:nbn:de:swb:90-576127
KITopen ID: 1000057612
HGF-Programm 43.21.04; LK 01
Erschienen in Advanced materials
Band 28
Heft 18
Seiten 3473-3480
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