Ultrarobust Thin-Film Devices from Self-Assembled Metal-Terpyridine Oligomers
Karipidou, Z.; Branchi, B.; Sarpasan, M.; Knorr, N.; Rodin, V.; Friederich, P.
1; Neumann, T. 1; Meded, V. 1; Rosselli, S.; Nelles, G.; Wenzel, W. 1; Rampi, M. A.; Wrochem, F. von
1 Institut für Nanotechnologie (INT), Karlsruher Institut für Technologie (KIT)
1; Neumann, T. 1; Meded, V. 1; Rosselli, S.; Nelles, G.; Wenzel, W. 1; Rampi, M. A.; Wrochem, F. von1 Institut für Nanotechnologie (INT), Karlsruher Institut für Technologie (KIT)
Abstract (englisch):
Ultrathin molecular layers of FeII-terpyridine oligomers allow the fabrication of large-area crossbar junctions by conventional electrode vapor deposition. The junctions are electrically stable for over 2.5 years and operate over a wide range of temperatures (150–360 K) and voltages (±3 V) due to the high cohesive energy and packing density of the oligomer layer. Electrical measurements reveal ideal Richardson–Shottky emission in surprising agreement with electrochemical, optical, and photoemission data.
| Zugehörige Institution(en) am KIT | Institut für Nanotechnologie (INT) |
| Publikationstyp | Zeitschriftenaufsatz |
| Publikationsjahr | 2016 |
| Sprache | Englisch |
| Identifikator | ISSN: 0935-9648 urn:nbn:de:swb:90-576127 KITopen-ID: 1000057612 |
| HGF-Programm | 43.21.04 (POF III, LK 01) Molecular Engineering |
| Erschienen in | Advanced materials |
| Verlag | John Wiley and Sons |
| Band | 28 |
| Heft | 18 |
| Seiten | 3473-3480 |
| Nachgewiesen in | Scopus Dimensions Web of Science |