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Wiring up pre-characterized single-photon emitters by laser lithography

Shi, Q.; Sontheimer, B.; Nikolay, N.; Schell, A.W.; Fischer, J.; Naber, A.; Benson, O.; Wegener, M.

Abstract (englisch):
Future quantum optical chips will likely be hybrid in nature and include many single-photon emitters, waveguides, filters, as well as single-photon detectors. Here, we introduce a scalable optical localization-selection-lithography procedure for wiring up a large number of single-photon emitters via polymeric photonic wire bonds in three dimensions. First, we localize and characterize nitrogen vacancies in nanodiamonds inside a solid photoresist exhibiting low background fluorescence. Next, without intermediate steps and using the same optical instrument, we perform aligned three-dimensional laser lithography. As a proof of concept, we design, fabricate, and characterize three-dimensional functional waveguide elements on an optical chip. Each element consists of one single-photon emitter centered in a crossed-arc waveguide configuration, allowing for integrated optical excitation and efficient background suppression at the same time.

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Volltext §
DOI: 10.5445/IR/1000058886
DOI: 10.1038/srep31135
Zitationen: 22
Web of Science
Zitationen: 22
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Angewandte Physik (APH)
Institut für Nanotechnologie (INT)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2016
Sprache Englisch
Identifikator ISSN: 0068-1261
KITopen-ID: 1000058886
HGF-Programm 43.23.01 (POF III, LK 01)
Advanced Optical Lithography+Microscopy
Erschienen in Scientific reports
Band 6
Seiten 31135
Bemerkung zur Veröffentlichung Gefördert durch den KIT-Publikationsfonds
Nachgewiesen in Web of Science
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