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Wiring up pre-characterized single-photon emitters by laser lithography

Shi, Q.; Sontheimer, B.; Nikolay, N.; Schell, A.W.; Fischer, J.; Naber, A.; Benson, O.; Wegener, M.

Abstract (englisch):
Future quantum optical chips will likely be hybrid in nature and include many single-photon emitters, waveguides, filters, as well as single-photon detectors. Here, we introduce a scalable optical localization-selection-lithography procedure for wiring up a large number of single-photon emitters via polymeric photonic wire bonds in three dimensions. First, we localize and characterize nitrogen vacancies in nanodiamonds inside a solid photoresist exhibiting low background fluorescence. Next, without intermediate steps and using the same optical instrument, we perform aligned three-dimensional laser lithography. As a proof of concept, we design, fabricate, and characterize three-dimensional functional waveguide elements on an optical chip. Each element consists of one single-photon emitter centered in a crossed-arc waveguide configuration, allowing for integrated optical excitation and efficient background suppression at the same time.

Zugehörige Institution(en) am KIT Institut für Angewandte Physik (APH)
Institut für Nanotechnologie (INT)
Publikationstyp Zeitschriftenaufsatz
Jahr 2016
Sprache Englisch
Identifikator DOI: 10.1038/srep31135
ISSN: 0068-1261
URN: urn:nbn:de:swb:90-588868
KITopen ID: 1000058886
HGF-Programm 43.23.01; LK 01
Erschienen in Scientific reports
Band 6
Seiten 31135
Bemerkung zur Veröffentlichung Gefördert durch den KIT-Publikationsfonds
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