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Silicon–Organic and Plasmonic–Organic Hybrid Photonics [in press]

Heni, Wolfgang; Kutuvantavida, Yasar; Haffner, Christian; Zwickel, Heiner; Kieninger, Clemens; Wolf, Stefan; Lauermann, Matthias; Fedoryshyn, Yuriy; Tillack, Andreas F.; Johnson, Lewis E.; Elder, Delwin L.; Robinson, Bruce H.; Freude, Wolfgang; Koos, Christian; Leuthold, Juerg; Dalton, Larry R.

Abstract (englisch):
Chip-scale integration of electronics and photonics is recognized as important to the future of information technology, as is the exploitation of the best properties of electronics, photonics, and plasmonics to achieve this objective. However, significant challenges exist including matching the sizes of electronic and photonic circuits; achieving low-loss transition between electronics, photonics, and plasmonics; and developing and integrating new materials. This review focuses on a hybrid material approach illustrating the importance of both chemical and engineering concepts. Silicon–organic hybrid (SOH) and plasmonic–organic hybrid (POH) technologies have permitted dramatic improvements in electro-optic (EO) performance relevant to both digital and analog signal processing. For example, the voltage–length product of devices has been reduced to less than 40 Vμm, facilitating device footprints of <20 μm2 operating with digital voltage levels to frequencies above 170 GHz. Energy efficiency has been improved to around a femtojoule/bit. This improvement has been realized through exploitation of field enhancements permitted by new de ... mehr


Zugehörige Institution(en) am KIT Institut für Mikrostrukturtechnik (IMT)
Institut für Photonik und Quantenelektronik (IPQ)
Publikationstyp Zeitschriftenaufsatz
Jahr 2017
Sprache Englisch
Identifikator DOI: 10.1021/acsphotonics.7b00224
ISSN: 2330-4022
KITopen ID: 1000071765
HGF-Programm 43.23.03; LK 01
Erschienen in ACS photonics
Heft June
Bemerkung zur Veröffentlichung http://pubs.acs.org/doi/abs/10.1021/acsphotonics.7b00224
Schlagworte 2D materials; chipscale electronic−photonic integration; high-speed optical interconnects; material interfaces; multiscale theoretical simulations; nanoscale device architectures; organic electro-optic materials; RF photonics.
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