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Silicon-Organic and Plasmonic-Organic Hybrid Photonics

Heni, Wolfgang; Kutuvantavida, Yasar; Haffner, Christian; Zwickel, Heiner; Kieninger, Clemens; Wolf, Stefan; Lauermann, Matthias; Fedoryshyn, Yuriy; Tillack, Andreas F.; Johnson, Lewis E.; Elder, Delwin L.; Robinson, Bruce H.; Freude, Wolfgang; Koos, Christian; Leuthold, Juerg; Dalton, Larry R.

Chip-scale integration of electronics and photonics is recognized as important to the future of information technology, as is the exploitation of the best properties of electronics, photonics, and plasmonics to achieve this objective. However, significant challenges exist including matching the sizes of electronic and photonic circuits; achieving low-loss transition between electronics, photonics, and plasmonics; and developing and integrating new materials. This review focuses on a hybrid material approach illustrating the importance of both chemical and engineering concepts. Silicon–organic hybrid (SOH) and plasmonic–organic hybrid (POH) technologies have permitted dramatic improvements in electro-optic (EO) performance relevant to both digital and analog signal processing. For example, the voltage–length product of devices has been reduced to less than 40 Vμm, facilitating device footprints of <20 μm2 operating with digital voltage levels to frequencies above 170 GHz. Energy efficiency has been improved to around a femtojoule/bit. This improvement has been realized through exploitation of field enhancements permitted by new device architectures and through theory-guided improvements in organic electro-optic (OEO) materials. ... mehr

DOI: 10.1021/acsphotonics.7b00224
Zitationen: 105
Zitationen: 88
Zugehörige Institution(en) am KIT Institut für Mikrostrukturtechnik (IMT)
Institut für Photonik und Quantenelektronik (IPQ)
Karlsruhe School of Optics & Photonics (KSOP)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2017
Sprache Englisch
Identifikator ISSN: 2330-4022
KITopen-ID: 1000071765
HGF-Programm 43.23.03 (POF III, LK 01) Teratronics
Erschienen in ACS photonics
Verlag American Chemical Society (ACS)
Band 4
Heft 7
Seiten 1576-1590
Externe Relationen Siehe auch
Schlagwörter 2D materials; chipscale electronic−photonic integration; high-speed optical interconnects; material interfaces; multiscale theoretical simulations; nanoscale device architectures; organic electro-optic materials; RF photonics.
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