Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
Abstract (englisch):
To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
| Zugehörige Institution(en) am KIT | Institut für Photonik und Quantenelektronik (IPQ) |
| Publikationstyp | Hochschulschrift |
| Publikationsjahr | 2018 |
| Sprache | Englisch |
| Identifikator | ISBN: 978-3-7315-0746-8 ISSN: 1865-1100 urn:nbn:de:0072-779633 KITopen-ID: 1000077963 |
| Verlag | KIT Scientific Publishing |
| Umfang | XXI, 222 S. |
| Serie | Karlsruhe Series in Photonics and Communications / Karlsruhe Institute of Technology, Institute of Photonics and Quantum Electronics (IPQ) ; 21 |
| Art der Arbeit | Dissertation |
| Schlagwörter | Photonic Wire Bonding, optische Aufbau- und Verbindungstechnik, integrierte Photonik, Silizium-Photonik,, photonic wire bonding, optical interconnects, photonic integrated circuits, silicon photonics |