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Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Billah, Muhammad Rodlin; Blaicher, Matthias; Hoose, Tobias; Dietrich, Philipp-Immanuel; Marin-Palomo, Pablo; Lindenmann, Nicole; Nesic, Aleksandar; Hofmann, Andreas ORCID iD icon; Troppenz, Ute; Moehrle, Martin; Randel, Sebastian; Freude, Wolfgang; Koos, Christian

Abstract (englisch):

Efficient coupling of III-V light sources to silicon photonic circuits is one of the key challenges of integrated optics. Important requirements are low coupling losses, as well as small footprint and high yield of the overall assembly, along with the ability to use automated processes for large-scale production. In this paper, we demonstrate that photonic wire bonding addresses these challenges by exploiting direct-write two-photon lithography for in-situ fabrication of three-dimensional freeform waveguides between optical chips. In a series proof-of-concept experiments, we connect InP-based horizontal-cavity surface emitting lasers (HCSEL) to passive silicon photonic circuits with insertion losses down to 0.4 dB. To the best of our knowledge, this is the most efficient interface between an InP light source and a silicon photonic chip that has so far been demonstrated. Our experiments represent a key step in advancing photonic wire bonding to a universal integration platform for hybrid photonic multi-chip assemblies that combine known-good dies of different materials to high-performance hybrid multi-chip modules.

Zugehörige Institution(en) am KIT Institut für Automation und angewandte Informatik (IAI)
Institut für Mikrostrukturtechnik (IMT)
Institut für Photonik und Quantenelektronik (IPQ)
Universität Karlsruhe (TH) – Interfakultative Einrichtungen (Interfakultative Einrichtungen)
Karlsruhe School of Optics & Photonics (KSOP)
Publikationstyp Forschungsbericht/Preprint
Publikationsjahr 2018
Sprache Englisch
Identifikator KITopen-ID: 1000081349
HGF-Programm 43.23.03 (POF III, LK 01) Teratronics
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