KIT | KIT-Bibliothek | Impressum | Datenschutz
Open Access Logo
DOI: 10.5445/IR/1000085214
Veröffentlicht am 23.08.2018
DOI: 10.1080/19475411.2018.1496953

Shape memory alloy film damping for smart miniature systems

Ahmadi, S.; Jacob, K.; Wendler, F.; Kohl, M.

This paper presents a dynamic analysis of the free and forced vibration of a free-standing bridge of superelastic shape memory alloy TiNiCuCo film with ultra-low fatigue properties and evaluates its versatility for novel miniature scale damping applications. A thermodynamics-based finite element model is used to simulate the evolution of martensite phase fraction during load-induced martensitic phase transformation. The effects of pre-strain, strain rate and excitation load on the hysteresis of stress-strain characteristics are investigated in order to assess damping energies. The analysis is performed under non-isothermal conditions taking into account heat transfer and rate-dependence of release and absorption of latent heat. We show that damping energy can be maximized by applying an optimum pre-strain. A maximum damping capacity of 0.17 is determined for the case of complete stress-strain hysteresis loop during phase transformation.

Zugehörige Institution(en) am KIT Institut für Mikrostrukturtechnik (IMT)
Publikationstyp Zeitschriftenaufsatz
Jahr 2018
Sprache Englisch
Identifikator ISSN: 1947-5411, 1947-542X
URN: urn:nbn:de:swb:90-852149
KITopen-ID: 1000085214
HGF-Programm 43.22.01 (POF III, LK 01)
Erschienen in International journal of smart and nano materials
Band 9
Heft 3
Seiten 199-215
Schlagworte Shape memory alloy film, superelasticity, coupled finite element simulation, damping
Nachgewiesen in Scopus
KIT – Die Forschungsuniversität in der Helmholtz-Gemeinschaft KITopen Landing Page