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Virtual Test Method for Complex and Variant-Rich Automotive Systems

Lauber, Andreas 1; Guissouma, Houssem 1; Sax, Eric 1
1 Institut für Technik der Informationsverarbeitung (ITIV), Karlsruher Institut für Technologie (KIT)

Abstract:

The fast development of embedded automotive systems in form of connected Electronic Control Units (ECUs) has led to complex development processes. Especially for safetycritical functions, the testing activities are essential to check if the designed system complies with the requirements.
Nowadays, the continuous development of mobile electronic devices through software updates is performed almost on a daily basis. This trend is now starting to be observed in cyber-physical systems with higher safety priorities. In the automotive field, the rising software portion in the vehicles and the shortening technology life-cycles are accentuating the need for Software Over The Air (SOTA) updates. Despite the opportunities offered by SOTA updates, the current test processes and methods must be adapted to manage the resulting complexity throughout the life-cycle of the vehicles. Especially the typical variants abundance in automotive product lines is considered as an important challenge, which cannot be solved only by ”classical” testing methods such as Hardware-In-the-Loop.
In this paper, we present a testing method for variantrich systems, which can be applied for automotive software updates. ... mehr


Originalveröffentlichung
DOI: 10.1109/ICVES.2018.8519599
Scopus
Zitationen: 4
Dimensions
Zitationen: 3
Zugehörige Institution(en) am KIT Institut für Technik der Informationsverarbeitung (ITIV)
Publikationstyp Proceedingsbeitrag
Publikationsjahr 2018
Sprache Englisch
Identifikator ISBN: 978-1-5386-3543-8
urn:nbn:de:swb:90-859313
KITopen-ID: 1000085931
Erschienen in 2018 IEEE International Conference on Vehicular Electronics and Safety (ICVES), Madrid, E, September 12-14, 2018
Veranstaltung International Conference on Vehicular Electronics and Safety (ICVES 2018), Madrid, Spanien, 12.09.2018 – 14.09.2018
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten 151-157
Nachgewiesen in Dimensions
Scopus
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