Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates
Abstract (englisch):
Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations.
| Zugehörige Institution(en) am KIT | Institut für Angewandte Materialien - Werkstoff- und Biomechanik (IAM-WBM) |
| Publikationstyp | Hochschulschrift |
| Publikationsjahr | 2019 |
| Sprache | Englisch |
| Identifikator | ISBN: 978-3-7315-0853-3 ISSN: 2192-9963 urn:nbn:de:0072-861251 KITopen-ID: 1000086125 |
| Verlag | KIT Scientific Publishing |
| Umfang | X, 127 S. |
| Serie | Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie ; 77 |
| Art der Arbeit | Dissertation |
| Prüfungsdaten | 12.04.2018 |
| Vorab online veröffentlicht am | 30.08.2018 |
| Schlagwörter | Ink-jet drucken, Dünnschichtbauteil, flexible Elektronik, Synchrotron-Röntgenbeugung, elektromechanische Charakterisierung,, Ink-jet printing, thin-film devices, flexible electronics, synchrotron X-ray diffraction, electro-mechanical characterization |
| Relationen in KITopen |