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Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics

Koos, C.; Freude, W.; Randel, S.; Dietrich, P.-I.; Blaicher, M.; Xu, Y.; Billah, M. R.; Hoose, T.; Trappen, M.; Hofmann, A.

Abstract:
In this presentation, we give an overview of our recent progress in exploiting direct-write two-photon lithography for additive 3D fabrication of freeform micro-optical elements. These elements can be printed with highest precision in direct contact with the facets of photonic integrated circuits or optical fibers, thereby greatly simplifying alignment and improving coupling efficiency. The approach offers new perspectives for a wide variety of applications, ranging from advanced photonic multi-chip modules for high-speed communications and optical sensing to highly efficient astro-photonic systems. We are currently working on transferring the concept from laboratory demonstrations to industrial manufacturing.

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Postprint §
DOI: 10.5445/IR/1000087761
Veröffentlicht am 09.12.2019
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Automation und angewandte Informatik (IAI)
Institut für Mikrostrukturtechnik (IMT)
Institut für Photonik und Quantenelektronik (IPQ)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 01.07.2018
Sprache Englisch
Identifikator ISBN: 978-1-5386-6604-3
ISSN: 2162-7339
KITopen-ID: 1000087761
HGF-Programm 43.23.03 (POF III, LK 01) Teratronics
Erschienen in 20th International Conference on Transparent Optical Networks, ICTON 2018; Bucharest; Romania; 1 July 2018 through 5 July 2018
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten Art. Nr.: 8473851
Serie International Conference on Transparent Optical Networks ; 2018-July
Schlagwörter photonic integrated circuits, silicon photonics, hybrid integration, photonic wire bonding, micro-optics, two-photon lithography, astro-photonics
Nachgewiesen in Dimensions
Scopus
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