KIT | KIT-Bibliothek | Impressum | Datenschutz

Thermo-mechanical analysis of thermoelectric devices based on single p-n pair

Tian, Y.; Miao, Z.; Meng, X.; Yan, W.; Zhu, M.

Thermoelectric devices have significant thermal stress and deformation affected by the temperature difference, which affecting their working stability and life span. In this paper, thermoelectric pairs are allocated in the x, y and z directions respectively to a single thermoelectric pair. And the maximum stress and deformation in all schemes are calculated by the finite element analysis. The results show that the interaction of the thermoelectric pairs in the z direction makes the maximum stress and the deformation decrease. The interaction of the z-direction thermoelectric pairs is beneficial to the reliability of thermoelectric devices. When designing thermoelectric devices, reducing the number of arrangement in the x, y directions and increasing the number of arrangement in the z direction can effectively improve their working stability and life span.

Open Access Logo

Verlagsausgabe §
DOI: 10.5445/IR/1000095143
Veröffentlicht am 07.06.2019
DOI: 10.1016/j.egypro.2019.01.366
Zugehörige Institution(en) am KIT Institut für Mikrostrukturtechnik (IMT)
Publikationstyp Proceedingsbeitrag
Jahr 2019
Sprache Englisch
Identifikator ISSN: 1876-6102
KITopen-ID: 1000095143
Erschienen in 10th International Conference on Applied Energy, ICAE 2018; Hong Kong; China; 22 August 2018 through 25 August 2018
Verlag Elsevier, Amsterdam
Seiten 1559-1564
Serie Energy Procedia ; 158
Schlagworte thermoelectric device, thermoelectric pair, stress, deformation, finite element analysis
Nachgewiesen in Scopus
KIT – Die Forschungsuniversität in der Helmholtz-Gemeinschaft
KITopen Landing Page