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Thermo-mechanical analysis of thermoelectric devices based on single p-n pair

Tian, Y.; Miao, Z.; Meng, X.; Yan, W. 1; Zhu, M.
1 Institut für Mikrostrukturtechnik (IMT), Karlsruher Institut für Technologie (KIT)

Abstract:

Thermoelectric devices have significant thermal stress and deformation affected by the temperature difference, which affecting their working stability and life span. In this paper, thermoelectric pairs are allocated in the x, y and z directions respectively to a single thermoelectric pair. And the maximum stress and deformation in all schemes are calculated by the finite element analysis. The results show that the interaction of the thermoelectric pairs in the z direction makes the maximum stress and the deformation decrease. The interaction of the z-direction thermoelectric pairs is beneficial to the reliability of thermoelectric devices. When designing thermoelectric devices, reducing the number of arrangement in the x, y directions and increasing the number of arrangement in the z direction can effectively improve their working stability and life span.


Verlagsausgabe §
DOI: 10.5445/IR/1000095143
Veröffentlicht am 07.06.2019
Originalveröffentlichung
DOI: 10.1016/j.egypro.2019.01.366
Scopus
Zitationen: 6
Dimensions
Zitationen: 6
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Mikrostrukturtechnik (IMT)
Publikationstyp Proceedingsbeitrag
Publikationsjahr 2019
Sprache Englisch
Identifikator ISSN: 1876-6102
KITopen-ID: 1000095143
HGF-Programm 43.22.01 (POF III, LK 01) Functionality by Design
Erschienen in 10th International Conference on Applied Energy, ICAE 2018; Hong Kong; China; 22 August 2018 through 25 August 2018
Verlag Elsevier
Seiten 1559-1564
Serie Energy Procedia ; 158
Schlagwörter thermoelectric device, thermoelectric pair, stress, deformation, finite element analysis
Nachgewiesen in Scopus
Dimensions
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