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Comparative study of track-to-track fusion methods for cooperative tracking with bearings-only measurements

Radtke, S. 1; Li, K. ORCID iD icon 1; Noack, B. 1; Hanebeck, U. D. 1
1 Institut für Anthropomatik und Robotik (IAR), Karlsruher Institut für Technologie (KIT)

Abstract:

Using a network of spatially distributed sensors to track a moving object can be a challenging task. In applications with limited communication between sensor nodes and packet loss, it may be impossible to process measurements from these distributed sensor nodes in a central unit. Therefore, it is often necessary to use only the locally available measurements at the sensor nodes and afterwards merge all local tracks into one consistent result. In this paper, several different track-to-track fusion algorithms are compared to cooperatively track a moving object using only bearing measurements. It is shown that the Sample-based Fusion that uses a set of deterministic samples to reconstruct the cross-covariances is a suitable fusion algorithm for the considered setup. Furthermore, it provides the means to efficiently keep track of the cross-covariances between sensor nodes and therefore outperforms conservative methods. The proposed approach is also tested in a real-world indoor localization setup using bearings-only acoustic measurements from three microphone arrays.


Postprint §
DOI: 10.5445/IR/1000098318
Veröffentlicht am 13.03.2026
Originalveröffentlichung
DOI: 10.1109/ICPHYS.2019.8780330
Scopus
Zitationen: 21
Dimensions
Zitationen: 20
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Anthropomatik und Robotik (IAR)
Publikationstyp Proceedingsbeitrag
Publikationsjahr 2019
Sprache Englisch
Identifikator ISBN: 978-1-5386-8500-6
KITopen-ID: 1000098318
Erschienen in 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019; Howards Plaza Hotel Taipei; Taiwan; 06.05.-09.05.2019
Veranstaltung IEEE International Conference on Industrial Cyber Physical Systems (ICPS 2019), Taipeh, Taiwan, 06.05.2019 – 09.05.2019
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten 236-241
Vorab online veröffentlicht am 01.05.2019
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