Printed electronics offer great potential for new applications such as Internet of Things devices and wearables. A methodology for integration of design and process assessment based on a stepwise transfer of the circuit to be printed from printed circuit board test vehicles to the final printed substrate is introduced. A multi-layer vector ink-jet printing process with three functional links is presented using the example of the fabrication of a demonstrator circuit. This fabrication is realized using a newly set up printing system as enabling technology: Integration of a piezo print head into the path planning of the printing system and its control as virtual stepper axis enable highly precise vector printing yielding printed functional elements with low tolerances. Finally, process imrovements for assembly of surface mounted devices on printed foil substrates are outlined.