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Automated fabrication of multi-layer printed electronic circuits using a novel vector ink-jet printing process control and surface mounting of discrete components [in press]

Gengenbach, Ulrich; Ungerer, Martin ORCID iD icon; Koker, Liane ORCID iD icon; Reichert, Klaus-Martin; Stiller, Peter; Huang, Chegyuan; Hagenmeyer, Veit

Abstract (englisch):

Printed electronics offer great potential for new applications such as Internet of Things devices and wearables. A methodology for integration of design and process assessment based on a stepwise transfer of the circuit to be printed from printed circuit board test vehicles to the final printed substrate is introduced. A multi-layer vector ink-jet printing process with three functional links is presented using the example of the fabrication of a demonstrator circuit. This fabrication is realized using a newly set up printing system as enabling technology: Integration of a piezo print head into the path planning of the printing system and its control as virtual stepper axis enable highly precise vector printing yielding printed functional elements with low tolerances. Finally, process imrovements for assembly of surface mounted devices on printed foil substrates are outlined.

Zugehörige Institution(en) am KIT Institut für Automation und angewandte Informatik (IAI)
Publikationstyp Proceedingsbeitrag
Publikationsjahr 2019
Sprache Englisch
Identifikator KITopen-ID: 1000098846
HGF-Programm 43.22.03 (POF III, LK 01) Printed Materials and Systems
Erschienen in Joint Conference - 8th IFAC Symposium on Mechatronic Systems - 11th Symposium on Nonlinear Control Systems, September 4-6, 2019, Vienna, Austria
Veranstaltung 8th / 11th IFAC Symposium on Mechatronic Systems and IFAC Symposium on Nonlinear Control Systems (MECHATRONICS / NOLCOS 2019), Wien, Österreich, 04.09.2019 – 06.09.2019
Schlagwörter functional printing, printed circuits, process automation, system design, iterative improvement, transcoders, piezo print had as virtual stepper axis
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