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Novel production method for large double-sided microstrip detectors of the CBM Silicon Tracking System at FAIR

Pfistner, P. 1; Caselle, M. 1; Blank, T. ORCID iD icon 1; Weber, M. 1; CBM Collaboration [Hrsg.]
1 Karlsruher Institut für Technologie (KIT)


The silicon sensors of the Silicon Tracking System of the Compressed Baryonic Matter experiment at FAIR, GSI are connected to the read-out electronics by low mass flexible microcables due to tight material budget restrictions. The cable length of up to 50 cm and its flexible nature make detector module assembly one of the most critical parts in STS. A novel low mass, low capacitance multilayer copper microcable has been designed and produced to facilitate detector assembly. Furthermore, a novel detector production method based on high-density gold stud bump bonding of silicon die on microcable has been developed. We present the Cu microcable design, capacitance simulations and measurements together with the individual steps performed in the STS detector assembly.

Verlagsausgabe §
DOI: 10.5445/IR/1000100188
Veröffentlicht am 04.12.2019
DOI: 10.22323/1.343.0144
Zitationen: 2
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Prozessdatenverarbeitung und Elektronik (IPE)
Publikationstyp Proceedingsbeitrag
Publikationsjahr 2019
Sprache Englisch
Identifikator ISSN: 1824-8039
KITopen-ID: 1000100188
HGF-Programm 54.02.01 (POF III, LK 01) Optische Signalübertragung
Erschienen in Topical Workshop on Electronics for Particle Physics (TWEPP2018) - Production, Testing and Reliability
Veranstaltung Topical Workshop on Electronics for Particle Physics (TWEPP 2018), Antwerpen, Belgien, 17.09.2018 – 21.09.2018
Verlag Scuola Internazionale Superiore di Studi Avanzati (SISSA)
Serie Proceedings of Science ; 343
Vorab online veröffentlicht am 06.06.2019
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