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Manufacturing influences on microstructure and fracture mechanical properties of polycrystalline tungsten

Conte, M. 1; Aktaa, J. 1
1 Institut für Angewandte Materialien - Werkstoff- und Biomechanik (IAM-WBM), Karlsruher Institut für Technologie (KIT)

Abstract (englisch):

Polycrystalline tungsten is a promising candidate for future fusion applications as plasma facing material due to its good thermophysical properties at high temperatures. Fracture mechanical properties of sintered and rolled, commercially available polycrystalline tungsten are characterized taking into account the strong anisotropy due to different grain shape and orientation with respect to the rolling direction. The fracture mechanics investigations are accompanied by fractographic analyses of two tungsten plate grades with varying cold working ratios of two different manufacturers (PLANSEE SE, Austria and A.L.M.T Corp., Japan). In this respect three point bending tests (3-PB) with sub sized fracture mechanical specimens in different orientations of the anisotropic microstructure are performed at three temperatures, ranging from 25 °C to 400 °C at a deflection rate of 2 µm s − 1. In addition, crack initiation and crack growth mechanisms depending on texture and cold working ratio are investigated by means of scanning electron microscopy (SEM).

Verlagsausgabe §
DOI: 10.5445/IR/1000100211
DOI: 10.1016/j.nme.2019.01.025
Zitationen: 10
Zitationen: 9
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Angewandte Materialien - Werkstoff- und Biomechanik (IAM-WBM)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2019
Sprache Englisch
Identifikator ISSN: 2352-1791
KITopen-ID: 1000100211
HGF-Programm 31.03.09 (POF III, LK 01) Strukturmaterial f. Blanket und Divertor
Erschienen in Nuclear materials and energy
Verlag Elsevier
Band 21
Seiten Article No.100591
Vorab online veröffentlicht am 09.11.2019
Schlagwörter Fracture toughness; Polycrystalline tungsten; Orientations dependency; Crack path analysis
Nachgewiesen in Web of Science
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