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Automated assembly of large double-sided microstrip detector modules of the CBM Silicon Tracking System at FAIR

Pfistner, P. 1; Blank, T. ORCID iD icon 1; Speck, R. 1; Weber, M. 1
1 Karlsruher Institut für Technologie (KIT)


The detector modules of the Silicon Tracking System of the Compressed Baryonic Matter experiment at FAIR comprise double-sided silicon microstrip sensors with a size of up to 124 mm x 62 mm. Due to tight material budget constraints, the sensors are connected to the read-out electronics by long flexible microcables. As manual assembly of the modules is time-consuming and difficult, a fully customized in-house bonder machine has been developed which allows for a highly automated detector module assembly. We present the requirements and the setup of the bonder machine together with the achieved alignment accuracy and first assemblies.

Verlagsausgabe §
DOI: 10.5445/IR/1000121386
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Prozessdatenverarbeitung und Elektronik (IPE)
Publikationstyp Proceedingsbeitrag
Publikationsjahr 2019
Sprache Englisch
Identifikator ISSN: 1824-8039
KITopen-ID: 1000121386
HGF-Programm 54.02.03 (POF III, LK 01) ASICs und Integrationstechnologien
Erschienen in Proceedings of Topical Workshop on Electronics for Particle Physics, TWEPP 2019, Santiago de Compostela, Spain, 2 - 6 September 2019
Veranstaltung Topical Workshop on Electronics for Particle Physics (TWEPP 2019), Santiago de Compostela, Spanien, 02.09.2019 – 06.09.2019
Seiten Code 160323
Serie Proceedings of Science ; 370
Nachgewiesen in Dimensions
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