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Milling parameter and tool wear dependent surface quality in micro-milling of brass

Dehen, S. 1; Segebade, E. 1; Gerstenmeyer, M. 1; Zanger, F. ORCID iD icon 1; Schulze, V. 1
1 Institut für Produktionstechnik (WBK), Karlsruher Institut für Technologie (KIT)


Short life-time and high tool costs still remain major constraints for the micro-milling process. Understanding the wear mechanisms and their effects on the workpiece quality is essential for efficient tool usage. Usually, wear increases the cutting forces and reduces the emerging surface quality during the micro-milling process. Due to high tool costs, cutting parameters are usually chosen for optimal tool lifetime and/or process time rather than optimal surface quality.
The scope of this paper is to investigate the correlation of the process parameters, strategy and wear status of the tool on the resulting surface topography. To reach this goal, micro-milling experiments were conducted, in which several grooves were milled using two end milling tools, new and worn, with a diameter of 1.5 mm and four cutting edges. The cutting speed and feed were varied, as well as the cutting direction. Brass was chosen as workpiece material to ensure a constant wear state of the tools during the experiments. During the cutting process the process forces were recorded and examined for their magnitude and frequency response. Furthermore, the grooves were analyzed optically for their surface roughness.
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Verlagsausgabe §
DOI: 10.5445/IR/1000122095
Veröffentlicht am 27.07.2020
DOI: 10.1016/j.procir.2020.02.024
Zitationen: 4
Zitationen: 3
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Produktionstechnik (WBK)
Publikationstyp Proceedingsbeitrag
Publikationsjahr 2020
Sprache Englisch
Identifikator ISSN: 2212-8271
KITopen-ID: 1000122095
Erschienen in 5th CIRP Conference on Surface Integrity (CSI 2020), 1st E-Conference, 1 - 5 June 2020. Ed.: Pedro J. Arrazola
Veranstaltung 5th CIRP Conference on Surface Integrity (CSI 2020), Online, 01.06.2020 – 05.06.2020
Verlag Elsevier
Seiten 95-100
Serie Procedia CIRP ; 87
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