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Complementary Machining: Effect of tool types on tool wear and surface integrity of AISI 4140

Schwalm, J.; Gerstenmeyer, M.; Zanger, F.; Schulze, V.

Abstract:
Complementary Machining is a process strategy for the time-efficient mechanical surface treatment of metallic workpieces. The characteristic of Complementary Machining is that after machining, a mechanical surface treatment is carried out using the cutting tool. The cutting tool moves over the workpiece surface in opposite direction to the machining process and induces an elastic-plastic deformation in the surface layer. Previous investigations have shown the possibility to achieve life-enhancing surface layer states in turning of AISI 4140 with Complementary Machining and to achieve fatigue strengths comparable to those after shot peening.
In this paper, the influence of the tool types and process parameters, such as the feed rate, on the resulting topography and the tool wear, represented by changes of cutting edge microgeometry, during Complementary Machining of AISI 4140 are investigated based on the previous investigations. In addition to different substrates of the cutting insert, the focus of the investigations is also on the influence of tool coating. Both the tool wear and the resulting topography were analyzed tactilely and correlated with the process parameters. ... mehr

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Verlagsausgabe §
DOI: 10.5445/IR/1000122096
Veröffentlicht am 27.07.2020
Originalveröffentlichung
DOI: 10.1016/j.procir.2020.02.035
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Produktionstechnik (WBK)
Publikationstyp Proceedingsbeitrag
Publikationsjahr 2020
Sprache Englisch
Identifikator ISSN: 2212-8271
KITopen-ID: 1000122096
Erschienen in 5th CIRP Conference on Surface Integrity (CSI 2020), 1st E-Conference, 1 - 5 June 2020. Ed.: Pedro J. Arrazola
Veranstaltung 5th CIRP Conference on Surface Integrity (CSI 2020), E-Conference, 01.06.2020 – 05.06.2020
Verlag Elsevier, Amsterdam
Seiten 89-94
Serie Procedia CIRP ; 87
Externe Relationen Konferenz
Nachgewiesen in Scopus
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