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Comprehensive Study of the Deformation Behavior during Diffusion Bonding of 1.4301 (AISI 304) as a Function of Material Width and Aspect Ratio

Gietzelt, Thomas; Toth, Volker; Kraut, Manfred; Gerhards, Uta; Dürrschnabel, Robin

In this paper, the impact of material width as well as aspect ratio on deformation during diffusion bonding of layered samples were investigated. For this, six annular samples with a constant cross-sectional area but an increasing diameter and thus decreasing material width were designed. In a first set of experiments, specimens of a constant height of h = 20 mm were examined. Each sample consisted of 10 sheets, 2 mm in thickness each. Diffusion bonding was performed at T = 1075 °C, t = 4 h and p = 15 MPa. Subsequently, additional samples with a constant aspect ratio of about three but different material width were diffusion bonded. For this, additional layers were added. It was expected that the deformation should be nearly constant for a constant aspect ratio. However, comparing the deformation to a sample possessing an aspect ratio of about three from the first batch, a much higher deformation was obtained now. Bonding a third sample, a deformation in the same range as for the other two samples of the second batch was obtained. It was found that due to the evaporation of metals, the thermocouples were subjected to aging, which was proven indirectly by the evaluation of heating power. ... mehr

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Verlagsausgabe §
DOI: 10.5445/IR/1000122852
Veröffentlicht am 20.08.2020
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Mikroverfahrenstechnik (IMVT)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2020
Sprache Englisch
Identifikator ISSN: 2075-4701
KITopen-ID: 1000122852
HGF-Programm 37.03.02 (POF III, LK 01) Components and Process Development
Erschienen in Metals
Verlag MDPI
Band 10
Heft 9
Seiten Art. Nr.: 1116
Vorab online veröffentlicht am 19.08.2020
Schlagwörter diffusion welding, diffusion bonding, cross-section width, aspect ratio, material width, thermocouple aging
Nachgewiesen in Web of Science
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