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Additive Manufacturing: Comparative Study of an IoT Integrated Approach and a Conventional Solution

Shandilya, Harshit; Kuchta, Matthias; Elkaseer, Ahmed; Müller, Tobias ORCID iD icon; Scholz, Steffen G. ORCID iD icon

Abstract:

The domain of additive manufacturing is an ever-growing sphere of research that will soon make its mark in countless industrial applications. The prowess of additive manufacturing increases significantly when it is integrated along with the Internet of Things. Upon connecting a Prusa MK3S 3D printer to a Raspberry Pi 3B and operating it via Octoprint, the merits of IoT integration are assessed. Comparing the samples from an IoT integrated printer and a standard printer, a contrast is made between the print qualities of the test samples from the two methods of printing. Combining the additive manufacturing set up along with IoT, multiple additional functionalities are obtained, including remote monitoring, remote operation and lower computing requirements. The results of the experiments lead us to the conclusion that the setup can be operated with lesser computing power and also incorporate remote operation and monitoring while maintaining acceptable print quality. The loss in print quality from the IoT approach is negligible when juxtaposed with the prints from a standard desktop operated printer.


Originalveröffentlichung
DOI: 10.1007/978-3-030-63089-8_64
Scopus
Zitationen: 1
Dimensions
Zitationen: 1
Zugehörige Institution(en) am KIT Institut für Automation und angewandte Informatik (IAI)
Karlsruhe Nano Micro Facility (KNMF)
Publikationstyp Proceedingsbeitrag
Publikationsjahr 2021
Sprache Englisch
Identifikator ISBN: 978-3-030-63088-1
ISSN: 2194-5357
KITopen-ID: 1000126381
HGF-Programm 43.22.03 (POF III, LK 01) Printed Materials and Systems
Weitere HGF-Programme 49.01.12 (POF III, LK 02) 3D Printing
Erschienen in Proceedings of the Future Technologies Conference (FTC) 2020, Volume 2. Ed.: K. Arai
Veranstaltung Future Technologies Conference (FTC 2020), Online, 05.11.2020 – 06.11.2020
Verlag Springer International Publishing
Seiten 976–986
Serie Advances in Intelligent Systems and Computing (AISC) ; 1289
Vorab online veröffentlicht am 01.11.2020
Schlagwörter Proposal ID: 2020-024028989; 3DP
Nachgewiesen in Dimensions
Scopus
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