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Numerical optimisation of mechanical ring reinforcement for bulk high-temperature superconductors

Barthlott, D. 1; Huang, K. Y.; Durrell, J. H.; Cardwell, D. A.; Holzapfel, B. ORCID iD icon 1; Ainslie, M. D.
1 Institut für Technische Physik (ITEP), Karlsruher Institut für Technologie (KIT)

Abstract:

The finite element method has been used extensively in recent years to solve various problems related to applied superconductivity and provides a useful tool for analysing and predicting experimental results. Based on a recently-developed modelling framework, implemented in the finite element software package COMSOL Multiphysics, investigations on the minimum ring reinforcement required to prevent mechanical failure in bulk high-temperature superconducting magnets have been carried out. Assuming homogeneous J$_{c}$(B,T) across the bulk sample irrespective of its dimensions, the maximum magnetic stresses experienced, and the minimum ring thickness required to prevent the hoop and radial stresses from exceeding the tensile strength of the bulk superconductor have been determined for varying values of the Young's modulus, radius, height and temperature of a representative single-grain Ag-containing Gd-Ba-Cu-O bulk sample. This comprehensive analysis details the influence each of these key parameters has on the magnetic stress and hence their impact on the necessary ring thickness to prevent mechanical failure in any given system, i.e., for any combination of material properties and sample dimensions.


Verlagsausgabe §
DOI: 10.5445/IR/1000127248
Veröffentlicht am 07.12.2020
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Technische Physik (ITEP)
Publikationstyp Zeitschriftenaufsatz
Publikationsmonat/-jahr 06.2020
Sprache Englisch
Identifikator ISSN: 1742-6588, 1742-6596
KITopen-ID: 1000127248
HGF-Programm 37.06.02 (POF III, LK 01) New Power Network Technology
Erschienen in Journal of Physics: Conference Series
Verlag Institute of Physics Publishing Ltd (IOP Publishing Ltd)
Band 1559
Seiten 012031
Bemerkung zur Veröffentlichung 14th European Conference on Applied Superconductivity, EUCAS 2019, Glasgow, United Kingdom, 1 - 5 September 2019
Vorab online veröffentlicht am 20.06.2020
Nachgewiesen in Dimensions
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