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Semi-Automated Packaging of Transducer Arrays for 3D Ultrasound Computer Tomography

Angerer, Martin ORCID iD icon 1; Zapf, Michael 1; Leyrer, Benjamin 1; Ruiter, Nicole V. ORCID iD icon 1
1 Institut für Prozessdatenverarbeitung und Elektronik (IPE), Karlsruher Institut für Technologie (KIT)


A semi-automated packaging process for transducer array manufacturing is presented. As an major innovation, a transducer disc is integrated in a sandwich structure between a printed circuit board (PCB) and an acoustic matching layer. Each of the transducer discs contains 18 lead-zirconium-titanate (PZT) fibres embedded in epoxy. To interconnect the transducer array components, adhesive bonding and automatic pick-and-place processes were used. A pre-series was evaluated by measuring the electro-mechanical impedance (EMI) before and after the assembly. Statistical analysis showed consistent behaviour of the series resonance f s and the electro-mechanical coupling k eff before and after the packaging. This encouraged the manufacturing of 256 arrays. These arrays will now be integrated in an ultrasound computer tomography (USCT) system with 3D scanning aperture for breast cancer imaging. With this system, we intend to bridge the gap towards clinical use of full 3D USCT.

DOI: 10.1109/SENSORS47125.2020.9278720
Zitationen: 7
Zitationen: 7
Zugehörige Institution(en) am KIT Institut für Prozessdatenverarbeitung und Elektronik (IPE)
Publikationstyp Proceedingsbeitrag
Publikationsmonat/-jahr 10.2020
Sprache Englisch
Identifikator ISBN: 978-1-72816-801-2
KITopen-ID: 1000127756
HGF-Programm 54.02.02 (POF III, LK 01) Ultraschnelle Datenauswertung
Erschienen in 2020 IEEE Sensors
Veranstaltung IEEE SENSORS (2020), Online, 25.10.2020 – 28.10.2020
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten 1–4
Nachgewiesen in Dimensions
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