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Is Pressureless Sintering Ready for Power Electronic Modules?

Blank, Thomas ORCID iD icon; Luh, Matthias ORCID iD icon; Leyrer, Benjamin; Scherer, Torsten; Trouillet, Vanessa; Pochert, Matthias; Wurst, Helge; An, Bao Ngoc; Weber, Marc; Ishikawa, Dai


IGBTs, power MOSFETs and diodes used in power modules operated at high temperatures of 175deg C and above are increasingly pressure sintered instead of soldered. Pressureless sintering methods are not widely used for power modules as the mechanical robustness in shear tests is not comparable to those of pressure sintered dies. Furthermore, the die size is limited to about 10 mm x 10 mm in pressureless sintering processes. This paper investigated the properties of recently proposed pressureless silver and copper sinter pastes with high mechanical robustness. Shear tests of 2.3 x 2.3 mm2 large test chips sintered by copper pastes onto copper substrates reach up to 78 MPa. Extraordinarily high shear values of up to 110 MPa using pressureless silver sinter paste on Electroless Nickel, Electroless Palladium, Immersion Gold (ENEPIG) clad DBC substrates have been measured. Due to this high mechanical robustness the pastes are evaluated for sintering larger dies up to a size of 4.0 x 4.0 mm2. Additionally, copper bond buffers have been sintered without pressure on the top side of electrochemically copper-plated IGBTs measuring 4.0 x 4.0 mm2 to increase their operational robustness. ... mehr

Zitationen: 4
Zugehörige Institution(en) am KIT Institut für Angewandte Materialien – Energiespeichersysteme (IAM-ESS)
Institut für Nanotechnologie (INT)
Institut für Prozessdatenverarbeitung und Elektronik (IPE)
Publikationstyp Proceedingsbeitrag
Publikationsjahr 2020
Sprache Englisch
Identifikator ISBN: 978-3-8007-5225-6
ISSN: 0341-3934
KITopen-ID: 1000127909
HGF-Programm 37.01.03 (POF III, LK 01) Batteries in Application
Erschienen in 11th International Conference on Integrated Power Electronics Systems (CIPS 2020)
Veranstaltung 11th International Conference on Integrated Power Electronics Systems (CIPS 2020), Berlin, Deutschland, 24.03.2020 – 26.03.2020
Verlag VDE Verlag
Seiten 1-6
Serie ETG-Fachbericht ; 161
Nachgewiesen in Scopus
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