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Time resolution studies of Timepix3 assemblies with thin silicon pixel sensors

Pitters, F.; Tehrani, N. Alipour; Dannheim, D.; Fiergolski, A.; Hynds, D.; Klempt, W.; Llopart, X.; Munker, M.; Nürnberg, A. 1; Spannagel, S.; Williams, M.
1 Karlsruher Institut für Technologie (KIT)

Abstract:

Timepix3 is a multi-purpose readout ASIC for hybrid pixel detectors. It can measure time and amplitude simultaneously by employing time-of-arrival (ToA) and time-over-threshold (ToT) techniques. Both methods are systematically affected by timewalk. In this paper, a method for pixel-by-pixel calibration of the time response is presented. Assemblies of Timepix3 ASICs bump-bonded to thin planar silicon pixel sensors with thicknesses of 50 μ m, 100 μ m and 150 μ m are calibrated and characterised in particle beams. For minimum ionising particles, time resolutions down to 0.72 ± 0.04 ns are achieved.


Verlagsausgabe §
DOI: 10.5445/IR/1000129610
Originalveröffentlichung
DOI: 10.1088/1748-0221/14/05/P05022
Scopus
Zitationen: 13
Dimensions
Zitationen: 19
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Experimentelle Teilchenphysik (ETP)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2019
Sprache Englisch
Identifikator ISSN: 1748-0221
KITopen-ID: 1000129610
Erschienen in Journal of Instrumentation
Verlag Institute of Physics Publishing Ltd (IOP Publishing Ltd)
Band 14
Heft 05
Seiten Art. Nr.: P05022
Vorab online veröffentlicht am 24.05.2019
Nachgewiesen in Dimensions
Web of Science
Scopus
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