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Photonic-Electronic Ultra-Broadband Signal Processing: Concepts, Devices, and Applications

Koos, C.; Randel, S.; Freude, W.; Zwick, T.; Scheytt, J.C.; Witzens, J.; Walther; M.; Harter, T.; Ummethala, S.; Kieninger, C.; Zwickel, H.; Marin-Palomo, P.; Muehlbrandt, S.; Füllner, C.; Schaefer, J.; Gudyriev, S.; Zazzi, A.; Müller, J.; Tessmann, A.

Abstract (englisch):
Combining photonic integrated circuits (PIC) with millimeter-wave electronics opens novel perspectives in generation and detection of ultra-broadband signals with disruptive potential for a wide variety of applications. Here, we will give an overview on our recent progress in the field of ultra-broadband photonic-electronic signal processing, covering device concepts such as silicon plasmonic integration, signal processing concepts such as Kramers-Kronig-based phase reconstruction of THz signals, as well as application demonstrations in the field of high-speed wireless data transmission.

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Postprint §
DOI: 10.5445/IR/1000129764
Frei zugänglich ab 17.11.2021
Zugehörige Institution(en) am KIT Institut für Photonik und Quantenelektronik (IPQ)
Institut für Mikrostrukturtechnik (IMT)
Institut für Hochfrequenztechnik und Elektronik (IHE)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 16.11.2020
Sprache Englisch
Identifikator KITopen-ID: 1000129764
Erschienen in 2020 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS’20)
Veranstaltung BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS 2020), Online, 16.11.2020 – 19.11.2020
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Schlagwörter photonic integration, silicon photonics, plasmonics, hybrid integration, THz communications, Kramers-Kronig receiver
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