Photonic-Electronic Ultra-Broadband Signal Processing: Concepts, Devices, and Applications
Koos, C.; Randel, S.; Freude, W.; Zwick, T.; Scheytt, J. C.; Witzens, J.; Walther; M.; Harter, T.; Ummethala, S.; Kieninger, C.; Zwickel, H.; Marin-Palomo, P.; Muehlbrandt, S.
; Füllner, C.; Schaefer, J.; Gudyriev, S.; Zazzi, A.; Müller, J.;
; Füllner, C.; Schaefer, J.; Gudyriev, S.; Zazzi, A.; Müller, J.; Abstract (englisch):
Combining photonic integrated circuits (PIC) with millimeter-wave electronics opens novel perspectives in generation and detection of ultra-broadband signals with disruptive potential for a wide variety of applications. Here, we will give an overview on our recent progress in the field of ultra-broadband photonic-electronic signal processing, covering device concepts such as silicon plasmonic integration, signal processing concepts such as Kramers-Kronig-based phase reconstruction of THz signals, as well as application demonstrations in the field of high-speed wireless data transmission.
| Zugehörige Institution(en) am KIT | Institut für Hochfrequenztechnik und Elektronik (IHE) Institut für Mikrostrukturtechnik (IMT) Institut für Photonik und Quantenelektronik (IPQ) |
| Publikationstyp | Proceedingsbeitrag |
| Publikationsdatum | 09.04.2021 |
| Sprache | Englisch |
| Identifikator | ISBN: 978-1-7281-9750-0 KITopen-ID: 1000129764 |
| Erschienen in | 2020 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS’20) |
| Veranstaltung | BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS 2020), Online, 16.11.2020 – 19.11.2020 |
| Verlag | Institute of Electrical and Electronics Engineers (IEEE) |
| Bemerkung zur Veröffentlichung | Gesamtwerk DOI: 10.1109/BCICTS48439.2020 |
| Schlagwörter | photonic integration, silicon photonics, plasmonics, hybrid integration, THz communications, Kramers-Kronig receiver |
| Nachgewiesen in | Dimensions Scopus |