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Investigation of Thick-Film-Paste Rheology and Film Material for Pattern Transfer Printing (PTP) Technology

Adrian, Adrian; Rudolph, Dominik; Lossen, Jan; Willenbacher, Norbert

Steady cost pressure in silicon solar cell production leads to a continuous reduction of silver consumption per cell. Pattern Transfer Printing (PTP) technology enables to reduce silver consumption by depositing smaller front electrodes on solar cells. Here, we aim at a better understanding of the laser deposition process. The aspect ratio of printed lines improved with increasing paste yield stress but was lower than the theoretical aspect ratio for a given trench geometry, suggesting that line spreading was caused by the pressure that was due to the vaporization of volatile paste components and a yield stress reduction that was due to local paste heating. A low laser power threshold, mandatory to fabricate narrow electrodes with a high aspect ratio and low amount of debris, could be achieved using pastes with low boiling temperature of volatile components and poor wetting between paste and film. The material with the lowest light transmission exhibited the lowest laser power threshold. We attribute this to the weaker adhesion to the paste and a better alignment with the laser focal plane. Our results provide valuable guidelines for paste and film material design aimed at narrower electrodes, with a higher aspect ratio to be obtained at an even lower laser power threshold in PTP-based solar cell metallization.

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Verlagsausgabe §
DOI: 10.5445/IR/1000131218
Veröffentlicht am 08.04.2021
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Mechanische Verfahrenstechnik und Mechanik (MVM)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2021
Sprache Englisch
Identifikator ISSN: 2079-6412
KITopen-ID: 1000131218
Erschienen in Coatings
Verlag MDPI
Band 11
Heft 1
Seiten Art.-Nr. 108
Vorab online veröffentlicht am 19.01.2021
Nachgewiesen in Scopus
Web of Science
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