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Thermoelectric Cooling to Survive Commodity DRAMs in Harsh Environment Automotive Electronics

Mathew, Deepak M.; Kattan, Hammam 1; Weis, Christian; Henkel, Jörg 1; Wehn, Norbert; Amrouch, Hussam
1 Karlsruher Institut für Technologie (KIT)


Today, more and more commodity hardware devices are used in safety-critical applications, such as advanced driver assistance systems in automotive. These applications demand very high reliability of electronic components even in adverse environmental conditions, such as high temperatures. Ensuring the reliability of microelectronic components is a major challenge at these high temperatures. The computing systems of these applications rely on DRAMs as working memory, which are built upon bit cells that store charges in capacitors. These commodity DRAMs are optimized for cost per bit and not for high reliability. Thus, very high temperatures impose an enormous challenge for commodity DRAMs as the data retention time and reliability decrease largely, affecting the data correctness. Data correctness can be ensured up to certain temperatures by increasing the refresh rate to counterbalance the retention time reduction. However, this severely degrades the access latencies and the usable DRAM bandwidth. To overcome these limitations, we present for the first time a Thermoelectric Cooling (TEC) solution for commodity DRAMs in harsh-environments, such as automotive. ... mehr

Verlagsausgabe §
DOI: 10.5445/IR/1000134009
Veröffentlicht am 20.09.2021
DOI: 10.1109/ACCESS.2021.3084749
Zitationen: 9
Web of Science
Zitationen: 6
Zitationen: 10
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Technische Informatik (ITEC)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2021
Sprache Englisch
Identifikator ISSN: 2169-3536
KITopen-ID: 1000134009
Erschienen in IEEE Access
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Band 9
Seiten 83950 – 83962
Vorab online veröffentlicht am 28.05.2021
Nachgewiesen in Dimensions
Web of Science
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