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Transceiver ASIC in HVCMOS Technology for 3D Ultrasound Computer Tomography

Blanco, R.; Leys, R.; Schlote-Holubek, K.; Becker, L.; Zapf, M.; Steck, P.; Gemmeke, H.; Ruiter, N. V.; Peric, I. ORCID iD icon

Abstract (englisch):

Abstract3D Ultrasound Computer Tomography (3D USCT) is an imaging method for the early de-tection of breast cancer. It provides three-dimensional multimodal images of the breast. Thenew 3D USCT device developed currently at Karlsruhe Institute of Technology containsmore than two thousand ultrasound transducers placed in a water-filled aperture where thepatient submerges one breast. The ultrasound transducers are grouped as transducer arraysystems (TAS) of 18 receiver (RX) and transmitter (TX) elements. The transducer front-end electronics contain high-voltage (HV) and low-voltage (LV) amplifiers and switcheswhich are implemented as an application-specific integrated circuit (ASIC). This contribu-tion presents a patented mixed signal, multichannel, transceiver ASIC developed in a com-mercial 350 nm high-voltage CMOS (HV-CMOS) process. The HV-CMOS process provideslow-voltage and high-voltage transistors that can be combined on the same substrate. TheHV transistors can sustain voltages up to 120 V.

Verlagsausgabe §
DOI: 10.5445/IR/1000136034
Veröffentlicht am 30.07.2021
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Prozessdatenverarbeitung und Elektronik (IPE)
Publikationstyp Proceedingsbeitrag
Publikationsjahr 2021
Sprache Englisch
Identifikator ISBN: 978-3-7315-1054-3
KITopen-ID: 1000136034
HGF-Programm 54.12.03 (POF IV, LK 01) Science Systems
Weitere HGF-Programme 54.02.02 (POF III, LK 01) Ultraschnelle Datenauswertung
Erschienen in Proceedings of the International Workshop on Medical Ultrasound Tomography: 14.-15. Oct. 2019, Wayne State University, Detroit, Michigan, USA. Ed.: C. Böhm; T. Hopp; N. Ruiter; N. Duric
Veranstaltung 2nd International Workshop on Medical Ultrasound Tomography (MUST 2019), Detroit, MI, USA, 14.10.2019 – 15.10.2019
Verlag KIT Scientific Publishing
Seiten 259-270
Schlagwörter application-specific integrated circuit, front-end electronics, medical imaging
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