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Fast Auto-adaptive Gain Adaption for Improved Signal Dynamics

Lu, Z.; Zapf, M.; Ruiter, N. V. ORCID iD icon

Abstract (englisch):

In our 3D Ultrasound Computer Tomography system (USCT), the 12 bit ADC and factor 10 VGA are insufficient to resolve the smallest interesting signals. An adaptive front-end gain can solve this by object specific adaptions during the measurement. The 3D USCT II of the KIT device contains 157 Transmitter Array System (TAS). Each TAS has 13 piezoelectric transducers, corresponding analog signal front end (AFE) and an MSP430FG66xx series microcontroller (MCU). All TAS are connected to a control board through a two-wire serial bus system. Direct Memory Access (DMA) was used in the hardware to control the interrupt of the Universal Serial Communication Interfaces module (USCI). To complete the data transfer without occupying the MCUs of the TAS. A location-based general call was developed in the control system. The host transmits one frame long message to all TAS in a general call mode. This message contains the configurations of all TAS for the next measurement step. The address of each TAS corresponds to the location of each configuration in the long message. Thus, in the broadcast mode, each TAS only obtains the configuration information required by itself. ... mehr

Verlagsausgabe §
DOI: 10.5445/IR/1000136035
Veröffentlicht am 30.07.2021
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Prozessdatenverarbeitung und Elektronik (IPE)
Publikationstyp Proceedingsbeitrag
Publikationsjahr 2021
Sprache Englisch
Identifikator ISBN: 978-3-7315-1054-3
KITopen-ID: 1000136035
HGF-Programm 54.12.03 (POF IV, LK 01) Science Systems
Weitere HGF-Programme 54.02.02 (POF III, LK 01) Ultraschnelle Datenauswertung
Erschienen in Proceedings of the International Workshop on Medical Ultrasound Tomography: 14.-15. Oct. 2019, Wayne State University, Detroit, Michigan, USA. Ed.: C. Böhm; T. Hopp; N. Ruiter; N. Duric
Veranstaltung 2nd International Workshop on Medical Ultrasound Tomography (MUST 2019), Detroit, MI, USA, 14.10.2019 – 15.10.2019
Verlag KIT Scientific Publishing
Seiten 271-272
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