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Blending proteins in high moisture extrusion to design meat analogues: Rheological properties, morphology development and product properties

Wittek, Patrick 1; Karbstein, Heike P. 1; Emin, M. Azad 1
1 Institut für Bio- und Lebensmitteltechnik (BLT), Karlsruher Institut für Technologie (KIT)

Abstract:

High moisture extrusion (HME) of meat analogues is often performed with raw materials containing multiple components, e.g., blends of different protein-rich raw materials. For instance, blends of soy protein isolate (SPI) and another component, such as wheat gluten, are used particularly frequently. The positive effect of blending on product texture is well known but not yet well understood. Therefore, this work targets investigating the influence of blending in HME at a mechanistic level. For this, SPI and a model protein, whey protein concentrate (WPC), were blended at three different ratios (100:0, 85:15, 70:30) and extruded at typical HME conditions (55% water content, 115/125/133 °C material temperature). Process conditions, rheological properties, morphology development, product structure and product texture were analysed. With increasing WPC percentage, the anisotropic structures became more pronounced and the anisotropy index (AI) higher. The achieved AI from the extrudates with a ratio of 70:30 (SPI:WPC) were considerably higher than comparable extrudates reported in other studies. In all extrudates, a multiphase system was visible whose morphology had changed due to the WPC addition. ... mehr


Verlagsausgabe §
DOI: 10.5445/IR/1000136099
Veröffentlicht am 09.08.2021
Originalveröffentlichung
DOI: 10.3390/foods10071509
Scopus
Zitationen: 41
Dimensions
Zitationen: 40
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Bio- und Lebensmitteltechnik (BLT)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2021
Sprache Englisch
Identifikator ISSN: 2304-8158
KITopen-ID: 1000136099
Erschienen in Foods
Verlag MDPI
Band 10
Heft 7
Seiten Art. Nr.: 1509
Bemerkung zur Veröffentlichung Gefördert durch den KIT-Publikationsfonds
Vorab online veröffentlicht am 30.06.2021
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Web of Science
Scopus
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