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Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements

Xu, Yilin 1,2; Maier, Pascal ORCID iD icon 1,2; Blaicher, Matthias 1,2; Dietrich, Philipp-Immanuel 1,2; Marin-Palomo, Pablo 1; Hartmann, Wladislaw 1; Bao, Yiyang ORCID iD icon 1; Peng, Huanfa 1; Billah, Muhammad Rodlin 1,2; Singer, Stefan ORCID iD icon 1; Troppenz, Ute; Moehrle, Martin; Randel, Sebastian 1; Freude, Wolfgang 1; Koos, Christian 1,2
1 Institut für Photonik und Quantenelektronik (IPQ), Karlsruher Institut für Technologie (KIT)
2 Institut für Mikrostrukturtechnik (IMT), Karlsruher Institut für Technologie (KIT)


Combining semiconductor optical amplifiers (SOA) on direct-bandgap III–V substrates with low-loss silicon or silicon-nitride photonic integrated circuits (PIC) has been key to chip-scale external-cavity lasers (ECL) that offer wideband tunability along with small optical linewidths. However, fabrication of such devices still relies on technologically demanding monolithic integration of heterogeneous material systems or requires costly high-precision package-level assembly, often based on active alignment, to achieve low-loss coupling between the SOA and the external feedback circuits. In this paper, we demonstrate a novel class of hybrid ECL that overcome these limitations by exploiting 3D-printed photonic wire bonds as intra-cavity coupling elements. Photonic wire bonds can be written in-situ in a fully automated process with shapes adapted to the mode-field sizes and the positions of the chips at both ends, thereby providing low-loss coupling even in presence of limited placement accuracy. In a proof-of-concept experiment, we use an InP-based reflective SOA (RSOA) along with a silicon photonic external feedback circuit and demonstrate a single-mode tuning range from 1515 to 1565 nm along with side mode suppression ratios above 40 dB and intrinsic linewidths down to 105 kHz. ... mehr

Verlagsausgabe §
DOI: 10.5445/IR/1000136418
Veröffentlicht am 23.08.2021
DOI: 10.1038/s41598-021-95981-w
Zitationen: 26
Zitationen: 23
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Mikrostrukturtechnik (IMT)
Institut für Photonik und Quantenelektronik (IPQ)
Universität Karlsruhe (TH) – Interfakultative Einrichtungen (Interfakultative Einrichtungen)
Karlsruhe School of Optics & Photonics (KSOP)
Publikationstyp Zeitschriftenaufsatz
Publikationsdatum 12.08.2021
Sprache Englisch
Identifikator ISSN: 2045-2322
KITopen-ID: 1000136418
HGF-Programm 43.32.03 (POF IV, LK 01) Designed Optical Devices & Systems
Erschienen in Scientific reports
Verlag Nature Research
Band 11
Heft 1
Seiten Art.-Nr. 16426
Bemerkung zur Veröffentlichung Gefördert durch den KIT-Publikationsfonds
Nachgewiesen in Scopus
Web of Science
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