The Enrichment of (Cu, Sn) Solid Solution Driven by High-Pressure Torsion

Cu–14 wt% Sn alloy was annealed at temperatures of 320 and 500 °C. The concentration of tin c$_{init}$ in the copper-based matrix increased with annealing temperature. The annealed samples were subjected to high-pressure torsion (HPT) at 6 GPa, 5 turns, 1 rpa. HPT led to the refinement of Cu grains. The shape of the colonies of α + ε phases changed only slightly. The HPT-driven enrichment of the Cu-based solid solution with Sn atoms c$_{HPT}$–c$_{init}$ decreased with increasing c$_{init}$. The performed theoretical analysis explained this behavior of the HPT-driven enrichment.