KIT | KIT-Bibliothek | Impressum | Datenschutz

Small-Size Coaxial Resonant Applicator for Microwave Heating Assisted Additive Manufacturing

Li, Nanya 1; Link, Guido 1; Engler, Moritz 1; Jelonnek, John 1
1 Institut für Hochleistungsimpuls- und Mikrowellentechnik (IHM), Karlsruher Institut für Technologie (KIT)


This article introduces the design and analysis of a small-size coaxial resonant applicator for high-speed microwave heating-assisted additive manufacturing of multiple materials, such as continuous carbon fiber reinforced polymer composites, thermoplastic, and metal parts. The elaborated coaxial resonant applicator reduces the size and has a resonant frequency between 2.4 and 2.5 GHz. A TEM wave is stimulated in the applicator where the electrical field is polarized perpendicular to the filaments and, therefore, allows a maximum penetration depth. The electrical conductive filament is designed as a part of the inner conductor to enhance coupling efficiency. To prevent microwave leakage induced by the conductive material, a compact quarter wavelength filter was developed. The equivalent circuit of the filter was used to analyze the influence of structural parameters on the resonance frequency. The filter has been tested and good agreement between measured and simulated results is obtained. The heating behavior with varying input power has been investigated for polyamide, polylactic acid, and continuous carbon fiber reinforced polyamide filaments.

Postprint §
DOI: 10.5445/IR/1000138348
Veröffentlicht am 16.12.2021
DOI: 10.1109/TMTT.2021.3105431
Zitationen: 3
Web of Science
Zitationen: 3
Zitationen: 4
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Hochleistungsimpuls- und Mikrowellentechnik (IHM)
Publikationstyp Zeitschriftenaufsatz
Publikationsmonat/-jahr 08.2021
Sprache Englisch
Identifikator ISSN: 0018-9480, 1557-9670
KITopen-ID: 1000138348
HGF-Programm 38.03.02 (POF IV, LK 01) Power-based Fuels and Chemicals
Erschienen in IEEE transactions on microwave theory and techniques
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Band 69
Heft 11
Seiten 4631-4638
Vorab online veröffentlicht am 26.08.2021
Nachgewiesen in Scopus
Web of Science
KIT – Die Forschungsuniversität in der Helmholtz-Gemeinschaft
KITopen Landing Page