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Ultra-flexible β-Cu2-δSe-based p-type printed thermoelectric films

Mallick, Md Mofasser ORCID iD icon; Sarbajna, Avishek; Rösch, Andres Georg ORCID iD icon; Franke, Leonard; Geßwein, Holger; Eggeler, Yolita M. ORCID iD icon; Lemmer, Uli

Abstract (englisch):

Flexibility in a printed thermoelectric (TE) material is vital for low-cost manufacturing of shape-conformable TE devices. In this work, a one-pot facile method was adapted to prepare a Cu-Se-based printable ink. The ink was printed on flexible substrates followed by sintering to let β-Cu2-δSe phase be formed. The film is found to be exceptionally flexible with a change in film resistance < 30 % after 100 bending cycles. The performance of the flexible film then was enhanced by substituting ´Se` with ´S`. At room temperature (RT), a power factor of 250 µWm−1K−2 with a thermal conductivity κ of 0.52 Wm−1K−1 is attained in the 10 at.% S substituted film. Figure-of-merit ZT values of 0.15 at RT and 0.21 at 375 K are achieved. For ∆T of 45 K, a maximum power output of 0.32 W with an open-circuit voltage VOC of 12 mV is demonstrated using a TE-generator (Flex-TEG) with two thermocouples made of the prepared material.

DOI: 10.1016/j.apmt.2021.101269
Zitationen: 7
Zitationen: 8
Zugehörige Institution(en) am KIT Institut für Angewandte Materialien – Energiespeichersysteme (IAM-ESS)
Institut für Mikrostrukturtechnik (IMT)
Universität Karlsruhe (TH) – Interfakultative Einrichtungen (Interfakultative Einrichtungen)
Karlsruhe School of Optics & Photonics (KSOP)
Laboratorium für Elektronenmikroskopie (LEM)
Lichttechnisches Institut (LTI)
Universität Karlsruhe (TH) – Zentrale Einrichtungen (Zentrale Einrichtungen)
Publikationstyp Zeitschriftenaufsatz
Publikationsmonat/-jahr 03.2022
Sprache Englisch
Identifikator ISSN: 2352-9407
KITopen-ID: 1000140249
HGF-Programm 38.01.02 (POF IV, LK 01) Materials and Interfaces
Erschienen in Applied materials today
Verlag Elsevier
Band 26
Seiten Art.Nr. 101269
Projektinformation EXC 2082; 3DMM2O (DFG, DFG EXSTRAT, EXC 2082/1)
Vorab online veröffentlicht am 23.11.2021
Schlagwörter Printed thermoelectricHigh TE performanceFlexibleCu2SeTEG
Nachgewiesen in Scopus
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