KIT | KIT-Bibliothek | Impressum | Datenschutz

Ultra-flexible β-Cu2-δSe-based p-type printed thermoelectric films

Mallick, Md Mofasser; Sarbajna, Avishek; Rösch, Andres Georg; Franke, Leonard; Geßwein, Holger; Eggeler, Yolita M.; Lemmer, Uli

Abstract (englisch):
Flexibility in a printed thermoelectric (TE) material is vital for low-cost manufacturing of shape-conformable TE devices. In this work, a one-pot facile method was adapted to prepare a Cu-Se-based printable ink. The ink was printed on flexible substrates followed by sintering to let β-Cu2-δSe phase be formed. The film is found to be exceptionally flexible with a change in film resistance < 30 % after 100 bending cycles. The performance of the flexible film then was enhanced by substituting ´Se` with ´S`. At room temperature (RT), a power factor of 250 µWm−1K−2 with a thermal conductivity κ of 0.52 Wm−1K−1 is attained in the 10 at.% S substituted film. Figure-of-merit ZT values of 0.15 at RT and 0.21 at 375 K are achieved. For ∆T of 45 K, a maximum power output of 0.32 W with an open-circuit voltage VOC of 12 mV is demonstrated using a TE-generator (Flex-TEG) with two thermocouples made of the prepared material.

DOI: 10.1016/j.apmt.2021.101269
Zugehörige Institution(en) am KIT Lichttechnisches Institut (LTI)
Laboratorium für Elektronenmikroskopie (LEM)
Institut für Angewandte Materialien - Energiespeichersysteme (IAM-ESS)
Institut für Mikrostrukturtechnik (IMT)
Publikationstyp Zeitschriftenaufsatz
Publikationsdatum 23.11.2021
Sprache Englisch
Identifikator ISSN: 2352-9407
KITopen-ID: 1000140249
Erschienen in Applied materials today
Verlag Elsevier
Seiten 101269
Projektinformation EXC 2082; 3DMM2O (DFG, DFG EXSTRAT, EXC 2082/1_I)
Vorab online veröffentlicht am 22.11.2021
Schlagwörter Printed thermoelectricHigh TE performanceFlexibleCu2SeTEG
KIT – Die Forschungsuniversität in der Helmholtz-Gemeinschaft
KITopen Landing Page