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Experimental and numerical analysis of mold filling in rotational molding

Nieschlag, J.; Seuffert, J.; Strack, D.; Friedmann, M.; Kärger, L.; Henning, F.; Fleischer, J.

Abstract:

This work focuses on the development of a numerical mold filling simulation for the rotational molding process. In the rotational molding process, a dry fiber preform is placed in a mold and impregnated with a thermoset matrix under rotation. Additionally, metallic load introduction elements can be inserted into the mold and joined with co-curing or form-fit, resulting in hybrid drive shafts or tie rods. The numerical model can be used to simulate the impregnation of the preform. Based on the resin transfer molding process, an OpenFOAM solver is extended for the rotational molding process. Permeability, kinetic and curing models are selected and adapted to the materials used. A wireless measurement solution with a capacitive sensor is developed to validate the model. Comparisons between measurements and numerically calculated impregnation times to reach the capacitive sensor with the matrix show good quality of the developed model. The average deviation between calculated result and measured mean values in the experiment is 43.8% the maximum deviation is 65.8% . The model can therefore be used to predict the impregnation progress and the curing state.


Verlagsausgabe §
DOI: 10.5445/IR/1000140529
Veröffentlicht am 03.12.2021
Originalveröffentlichung
DOI: 10.3390/jcs5110289
Scopus
Zitationen: 2
Dimensions
Zitationen: 2
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Fahrzeugsystemtechnik (FAST)
Institut für Produktionstechnik (WBK)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2021
Sprache Englisch
Identifikator ISSN: 2504-477X
KITopen-ID: 1000140529
Erschienen in Journal of Composites Science
Verlag MDPI
Band 5
Heft 11
Seiten 289
Bemerkung zur Veröffentlichung Gefördert durch den KIT-Publikationsfonds
Schlagwörter hybrid; numerical analysis; process monitoring; rotational molding
Nachgewiesen in Dimensions
Scopus
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