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Electrical and mechanical behaviour of metal thin films with deformation-induced cracks predicted by computational homogenisation

Kaiser, T.; Cordill, M. J.; Kirchlechner, C.; Menzel, A.


Motivated by advances in flexible electronic technologies and by the endeavour to develop non-destructive testing methods, this article analyses the capability of computational multiscale formulations to predict the influence of microscale cracks on effective macroscopic electrical and mechanical material properties. To this end, thin metal films under mechanical load are experimentally analysed by using in-situ confocal laser scanning microscopy (CLSM) and in-situ four point probe resistance measurements. Image processing techniques are then used to generate representative volume elements from the laser intensity images. These discrete representations of the crack pattern at the microscale serve as the basis for the calculation of effective macroscopic electrical conductivity and mechanical stiffness tensors by means of computational homogenisation approaches. A comparison of simulation results with experimental electrical resistance measurements and a detailed study of fundamental numerical properties demonstrates the applicability of the proposed approach. In particular, the (numerical) errors that are induced by the representative volume element size and by the finite element discretisation are studied, and the influence of the filter that is used in the generation process of the representative volume element is analysed.

Verlagsausgabe §
DOI: 10.5445/IR/1000142160
Veröffentlicht am 20.01.2022
DOI: 10.1007/s10704-021-00582-3
Zitationen: 3
Web of Science
Zitationen: 3
Zitationen: 4
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Angewandte Materialien - Werkstoff- und Biomechanik (IAM-WBM)
Publikationstyp Zeitschriftenaufsatz
Publikationsmonat/-jahr 10.2021
Sprache Englisch
Identifikator ISSN: 0376-9429, 1573-2673
KITopen-ID: 1000142160
HGF-Programm 43.31.01 (POF IV, LK 01) Multifunctionality Molecular Design & Material Architecture
Erschienen in International journal of fracture
Verlag Springer
Band 231
Heft 2
Seiten 223–242
Vorab online veröffentlicht am 05.10.2021
Nachgewiesen in Web of Science
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