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A Survey of Fault-Tolerance Techniques for Embedded Systems from the Perspective of Power, Energy, and Thermal Issues

Safari, S.; Ansari, M.; Khdr, H. ORCID iD icon; Nazari, P. G.; Yari-Karin, S.; Yeganeh-Khaksar, A.; Hessabi, S.; Ejlali, A.; Henkel, J.

Abstract:

The relentless technology scaling has provided a significant increase in processor performance, but on the other hand, it has led to adverse impacts on system reliability. In particular, technology scaling increases the processor susceptibility to radiation-induced transient faults. Moreover, technology scaling with the discontinuation of Dennard scaling increases the power densities, thereby temperatures, on the chip. High temperature, in turn, accelerates transistor aging mechanisms, which may ultimately lead to permanent faults on the chip. To assure a reliable system operation, despite these potential reliability concerns, fault-tolerance techniques have emerged. Specifically, fault-tolerance techniques employ some kind of redundancies to satisfy specific reliability requirements. However, the integration of fault-tolerance techniques into real-time embedded systems complicates preserving timing constraints. As a remedy, many task mapping/scheduling policies have been proposed to consider the integration of fault-tolerance techniques and enforce both timing and reliability guarantees for real-time embedded systems. More advanced techniques aim additionally at minimizing power and energy while at the same time satisfying timing and reliability constraints. ... mehr


Verlagsausgabe §
DOI: 10.5445/IR/1000142668
Veröffentlicht am 03.02.2022
Originalveröffentlichung
DOI: 10.1109/ACCESS.2022.3144217
Scopus
Zitationen: 31
Web of Science
Zitationen: 25
Dimensions
Zitationen: 38
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Technische Informatik (ITEC)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2022
Sprache Englisch
Identifikator ISSN: 2169-3536
KITopen-ID: 1000142668
Erschienen in IEEE Access
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Band 10
Seiten 12229 - 12251
Vorab online veröffentlicht am 20.01.2022
Nachgewiesen in Scopus
Dimensions
Web of Science
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