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Photonic Curing Enables Ultrarapid Processing of Highly Conducting β-Cu$_{2−δ}$Se Printed Thermoelectric Films in Less Than 10 ms

Mallick, Md Mofasser ORCID iD icon 1; Franke, Leonard 1; Rösch, Andres Georg ORCID iD icon 1; Geßwein, Holger 2; Eggeler, Yolita M. ORCID iD icon 3; Lemmer, Uli 1,4
1 Lichttechnisches Institut (LTI), Karlsruher Institut für Technologie (KIT)
2 Karlsruher Institut für Technologie (KIT)
3 Laboratorium für Elektronenmikroskopie (LEM), Karlsruher Institut für Technologie (KIT)
4 Institut für Mikrostrukturtechnik (IMT), Karlsruher Institut für Technologie (KIT)

Abstract (englisch):

It has been a challenge to obtain high electrical conductivity in inorganic printed thermoelectric (TE) films due to their high interfacial resistance. In this work, we report a facile synthesis process of Cu–Se-based printable ink for screen printing. A highly conducting TE β-Cu2−δSe phase forms in the screen-printed Cu–Se-based film through ≤10 ms sintering using photonic-curing technology, minimizing the interfacial resistance. This enables overcoming the major challenges associated with printed thermoelectrics: (a) to obtain the desired phase, (b) to attain high electrical conductivity, and (c) to obtain flexibility. Furthermore, the photonic-curing process reduces the synthesis time of the TE β-Cu2−δSe film from several days to a few milliseconds. The sintered film exhibits a remarkably high electrical conductivity of ∼3710 S cm–1 with a TE power factor of ∼100 μW m–1 K–2. The fast processing and high conductivity of the film could also be potentially useful for different printed electronics applications.


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Originalveröffentlichung
DOI: 10.1021/acsomega.2c00412
Scopus
Zitationen: 6
Dimensions
Zitationen: 6
Zugehörige Institution(en) am KIT Institut für Mikrostrukturtechnik (IMT)
Laboratorium für Elektronenmikroskopie (LEM)
Lichttechnisches Institut (LTI)
Publikationstyp Zeitschriftenaufsatz
Publikationsdatum 15.03.2022
Sprache Englisch
Identifikator ISSN: 2470-1343
KITopen-ID: 1000143751
HGF-Programm 38.01.02 (POF IV, LK 01) Materials and Interfaces
Erschienen in ACS Omega
Verlag American Chemical Society (ACS)
Band 7
Heft 12
Seiten 10695–10700
Projektinformation EXC 2082; 3DMM2O (DFG, DFG EXSTRAT, EXC 2082/1)
Vorab online veröffentlicht am 14.03.2022
Nachgewiesen in Dimensions
Web of Science
Scopus
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