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FLECSim-SoC: A Flexible End-to-End Co-Design Simulation Framework for System on Chips

Hotfilter, Tim ORCID iD icon 1; Hoefer, Julian ORCID iD icon 1; Kreß, Fabian ORCID iD icon 1; Kempf, Fabian 1; Becker, Juergen 1
1 Institut für Technik der Informationsverarbeitung (ITIV), Karlsruher Institut für Technologie (KIT)

Abstract (englisch):

Hardware accelerators for deep neural networks (DNNs) have established themselves over the past decade. Most developments have worked towards higher efficiency with an individual application in mind. This highlights the strong relationship between co-designing the accelerator together with the requirements of the application. Currently for a structured design flow, however, it lacks a tool to evaluate a DNN accelerator embedded in a System on Chip (SoC) platform.To address this gap in the state of the art, we introduce FLECSim, a tool framework that enables an end-to-end simulation of an SoC with dedicated accelerators, CPUs and memories. FLECSim offers flexible configuration of the system and straightforward integration of new accelerator models in both SystemC and RTL, which allows for early design verification. During the simulation, FLECSim provides metrics of the SoC, which can be used to explore the design space. Finally, we present the capabilities of FLECSim, perform an exemplary evaluation with a systolic array-based accelerator and explore the design parameters in terms of accelerator size, power and performance.

Postprint §
DOI: 10.5445/IR/1000144442
Veröffentlicht am 15.09.2022
DOI: 10.1109/SOCC52499.2021.9739212
Zitationen: 4
Zitationen: 4
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Technik der Informationsverarbeitung (ITIV)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 14.09.2021
Sprache Englisch
Identifikator ISBN: 978-1-66542-931-3
KITopen-ID: 1000144442
Erschienen in IEEE 34th International System-on-Chip Conference (SOCC), 14th-17th September 2021, Las Vegas, Nevada, USA
Veranstaltung 34th IEEE International System-on-Chip Conference (SOCC 2021), Online, 14.09.2021 – 17.09.2021
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten 83–88
Nachgewiesen in Dimensions
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