KIT | KIT-Bibliothek | Impressum | Datenschutz

Printed temperature sensor array for high-resolution thermal mapping

Bücher, Tim 1; Huber, Robert ORCID iD icon 2; Eschenbaum, Carsten 3; Mertens, Adrian 3; Lemmer, Uli 2,4; Amrouch, Hussam 1
1 Institut für Technische Informatik (ITEC), Karlsruher Institut für Technologie (KIT)
2 Lichttechnisches Institut (LTI), Karlsruher Institut für Technologie (KIT)
3 Institut für Photonik und Quantenelektronik (IPQ), Karlsruher Institut für Technologie (KIT)
4 Institut für Mikrostrukturtechnik (IMT), Karlsruher Institut für Technologie (KIT)

Abstract:

Fully-printed temperature sensor arrays—based on a flexible substrate and featuring a high spatial-temperature resolution—are immensely advantageous across a host of disciplines. These range from healthcare, quality and environmental monitoring to emerging technologies, such as artificial skins in soft robotics. Other noteworthy applications extend to the fields of power electronics and microelectronics, particularly thermal management for multi-core processor chips. However, the scope of temperature sensors is currently hindered by costly and complex manufacturing processes. Meanwhile, printed versions are rife with challenges pertaining to array size and sensor density. In this paper, we present a passive matrix sensor design consisting of two separate silver electrodes that sandwich one layer of sensing material, composed of poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS). This results in appreciably high sensor densities of 100 sensor pixels per cm2 for spatial-temperature readings, while a small array size is maintained. Thus, a major impediment to the expansive application of these sensors is efficiently resolved. ... mehr


Verlagsausgabe §
DOI: 10.5445/IR/1000150141
Veröffentlicht am 24.08.2022
Originalveröffentlichung
DOI: 10.1038/s41598-022-18321-6
Scopus
Zitationen: 14
Web of Science
Zitationen: 11
Dimensions
Zitationen: 15
Cover der Publikation
Zugehörige Institution(en) am KIT 3D Matter Made to Order (3DMM2O)
Institut für Mikrostrukturtechnik (IMT)
Institut für Photonik und Quantenelektronik (IPQ)
Institut für Technische Informatik (ITEC)
Karlsruhe School of Optics & Photonics (KSOP)
Lichttechnisches Institut (LTI)
Publikationstyp Zeitschriftenaufsatz
Publikationsdatum 20.08.2022
Sprache Englisch
Identifikator ISSN: 2045-2322
KITopen-ID: 1000150141
HGF-Programm 38.01.02 (POF IV, LK 01) Materials and Interfaces
Erschienen in Scientific Reports
Verlag Nature Research
Band 12
Heft 1
Seiten 14231
Nachgewiesen in Web of Science
Dimensions
Scopus
Globale Ziele für nachhaltige Entwicklung Ziel 9 – Industrie, Innovation und Infrastruktur
KIT – Die Forschungsuniversität in der Helmholtz-Gemeinschaft
KITopen Landing Page