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Sol–gel encapsulation for power electronics utilizing 3-Glycidyloxypropyltriethoxysilane and 3-Mercaptopropyltrimethoxysilane

Kohler, Tobias 1; Hejtmann, Georg; Henneck, Stefan; Schubert, Martin; Guyenot, Michael
1 Institut für Angewandte Materialien – Keramische Werkstoffe und Technologien (IAM-KWT1), Karlsruher Institut für Technologie (KIT)

Abstract:

3-Glycidyloxypropyltriethoxysilane and 3-Mercaptosilane were used to prepare a composite together with aluminum oxide. The compound is a potential candidate for being used as inorganic encapsulation. FTIR results paired with head-space analysis revealed a hardening of the composite at above 130 °C and degradation of the sol–gel-network above 150 °C. The adhesion of these compounds was tested via shear tests. It showed, that the addition of 3-Mercaptopropyltriethoxysilane enhanced the adhesion on silver significantly. This is attributed to the covalent nature of the Ag-S bond, which is forming as compared to the solely dispersive forces, when 3-Mercaptopropyltriethxysilane is not used. By conducting the shear test under temperature activation energies for the breakages were calculated. These coincide well with the binding energy of Ag-S in case silver surfaces are examined. In the case of a copper surface, a mixture of covalent and dipole–dipole interactions are found, since the activation energy for breakage is smaller as the Cu-O bond energy.


Verlagsausgabe §
DOI: 10.5445/IR/1000150329
Veröffentlicht am 02.09.2022
Originalveröffentlichung
DOI: 10.1007/s10971-022-05894-x
Scopus
Zitationen: 1
Web of Science
Zitationen: 1
Dimensions
Zitationen: 1
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Angewandte Materialien – Keramische Werkstoffe und Technologien (IAM-KWT1)
Publikationstyp Zeitschriftenaufsatz
Publikationsmonat/-jahr 09.2022
Sprache Englisch
Identifikator ISSN: 0928-0707, 1573-4846
KITopen-ID: 1000150329
Erschienen in Journal of Sol-Gel Science and Technology
Verlag Springer
Band 103
Heft 3
Seiten 832–842
Vorab online veröffentlicht am 09.07.2022
Nachgewiesen in Scopus
Dimensions
Web of Science
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