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Characterization of the Isothermal and Thermomechanical Fatigue Behavior of a Duplex Steel Considering the Alloy Microstructure

Schellert, Steven; Müller, Julian; Ohrndorf, Arne; Gorr, Bronslava 1; Butz, Benjamin; Christ, Hans-Jürgen
1 Institut für Angewandte Materialien – Angewandte Werkstoffphysik (IAM-AWP), Karlsruher Institut für Technologie (KIT)

Abstract:

Isothermal and thermomechanical fatigue behavior of duplex stainless steel (DSS) X2CrNiMoN22-5-3 was investigated. The aim of this work was to understand the fatigue behavior by correlation of the isothermal and thermomechanical fatigue behavior with microstructural observations. Fatigue tests at plastic-strain-amplitude of 0.2% were carried out at 20, 300 and 600 °C, while in-phase (IP) and out-of-phase (OP) thermomechanical fatigue (TMF) experiments were performed between 300 and 600 °C. During the 20 °C fatigue test, a continuous softening was observed. Transmission electron microscopy examinations reveal pronounced planar slip behavior in austenite. At 300 °C, deformation concentrates in the ferrite, where strong interactions between Cr$_{x}$N and dislocations were observed that explain the pronounced cyclic hardening. DSS studied exhibits softening throughout the whole isothermal fatigue test at 600 °C. In ferrite, during the 600 °C fatigue test, the G phase, γ′ austenite precipitated, and an unordered dislocation arrangement was observed. The stress responses of the TMF tests can be correlated to those of the isothermal fatigue tests. ... mehr


Verlagsausgabe §
DOI: 10.5445/IR/1000150416
Veröffentlicht am 06.09.2022
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Angewandte Materialien – Angewandte Werkstoffphysik (IAM-AWP)
Institut für Angewandte Materialien (IAM)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2022
Sprache Englisch
Identifikator ISSN: 2075-4701
KITopen-ID: 1000150416
HGF-Programm 38.04.03 (POF IV, LK 01) Thermal Energy Storage
Erschienen in Metals
Verlag MDPI
Band 12
Heft 7
Seiten Art.Nr. 1161
Bemerkung zur Veröffentlichung Gefördert durch den KIT-Publikationsfonds
Vorab online veröffentlicht am 07.07.2022
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