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Planar fiber-chip-coupling using angle-polished polarization maintaining fibers

Schneider, Marc ORCID iD icon 1; Garcia Herrera, Luis Alberto [Beteiligte*r] 1; Kühner, Thomas [Beteiligte*r] 1; Burger, Birgit [Beteiligte*r] 1; Eisenblätter, Lars [Beteiligte*r] 1
1 Institut für Prozessdatenverarbeitung und Elektronik (IPE), Karlsruher Institut für Technologie (KIT)

Abstract (englisch):

We report on our latest developments of a planar fiber-chip-coupling scheme, using angle polished, polarization maintaining (PM) fibers. Most integrated photonic chip components are polarization sensitive and a suitable way to launch several wavelength channels to the chip with the same polarization is the use of PM fibers. Those impose several challenges at processing and handling to achieve a stable, permanent, and low-loss coupling.
We present the processing of the fibers in detail and experimental results for our planar and compact fiber-chip-coupling technique.

Summary

High performance optical links using wavelength division multiplexing (WDM) are the future in detector instrumentation to increase data transmission bandwidth and reduce fiber count. A key component of such a system is a compact and efficient fiber-chip-coupling, connecting a photonic chip to the optical glass fibers. As most components of integrated photonic chips are polarization sensitive, one can use lossy on-chip polarization-insensitive couplers and polarization controllers or use polarization maintaining (PM) fibers to feed the required polarization directly from the lasers without the need of further manipulation.
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Volltext §
DOI: 10.5445/IR/1000152670
Veröffentlicht am 15.11.2022
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Prozessdatenverarbeitung und Elektronik (IPE)
Publikationstyp Poster
Publikationsdatum 20.09.2022
Sprache Englisch
Identifikator KITopen-ID: 1000152670
HGF-Programm 43.32.03 (POF IV, LK 01) Designed Optical Devices & Systems
Veranstaltung Topical Workshop on Electronics for Particle Physics (TWEPP 2022), Bergen, Norwegen, 19.09.2022 – 23.09.2022
Externe Relationen Abstract/Volltext
Folien/Poster
Schlagwörter photonics, fiber-chip-coupling, fiber-to-chip-coupling, fibers, glass fibers, angle polishing, telecom, datacom, high speed, optical links
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