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Capacitive Proximity Sensor for Non-Contact Endoscope Localization

Marzi, Christian ORCID iD icon 1; Alagi, Hosam ORCID iD icon 2; Rau, Olivia 3; Hampe, Jochen; Korvink, Jan Gerrit 3; Hein, Bjorn 2; Mathis-Ullrich, Franziska 2
1 Karlsruher Institut für Technologie (KIT)
2 Institut für Anthropomatik und Robotik (IAR), Karlsruher Institut für Technologie (KIT)
3 Institut für Mikrostrukturtechnik (IMT), Karlsruher Institut für Technologie (KIT)

Abstract (englisch):

The promising automation of flexible surgical instruments and robots is impeded by the lack of sensory means, which allow for sensing of an instrument's position to the surrounding tissue. This work presents a novel sensory method utilizing capacitive proximity sensing to derive a relative localization of a flexible instrument inside a hollow organ. The method is evaluated by exemplary integration of a sensor in a commercial gastroendoscope and accuracy analysis using a high precision robot. The results show an accuracy of distance sensing from a medical phantom's center of 2%. The method is also evaluated for the irregularly shaped surrounding of ex-vivo tissue in a dynamic scenario. This promising approach holds potential for transfer to clinical scenarios and for further development towards pose estimation of flexible surgical robots and shape sensing of a minimally invasive environment.


Originalveröffentlichung
DOI: 10.1109/ICRA46639.2022.9811734
Scopus
Zitationen: 4
Dimensions
Zitationen: 3
Zugehörige Institution(en) am KIT Institut für Anthropomatik und Robotik (IAR)
Institut für Mikrostrukturtechnik (IMT)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 23.05.2022
Sprache Englisch
Identifikator ISBN: 978-1-72819-681-7
KITopen-ID: 1000153341
HGF-Programm 43.35.01 (POF IV, LK 01) Platform for Correlative, In Situ & Operando Charakterizat.
Erschienen in 2022 International Conference on Robotics and Automation (ICRA)
Veranstaltung IEEE International Conference on Robotics and Automation (ICRA 2022), Philadelphia, PA, USA, 23.05.2022 – 27.05.2022
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten 9614–9620
Nachgewiesen in Scopus
Dimensions
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